Featured Report Analysis
Editorial: IBM Arms Up Next-Gen Z Systems CPU
IBM is evolving its decades‑long Z architecture by integrating AArch64, enabling native Arm execution within its mainframe platform.
Slides: DRAM Market Report Q2 2026
Quarterly DRAM report analyzes supply, demand, pricing, and market share across key segments, tracking capacity, trends, and technology shifts.
Analysis: AI Boom Drives Rising Revenues, ASPs, and Equipment Sales
Semiconductor equipment orders held steady this week at an index level of 98.
Ambiq Beta Release AI-Codec compressionKIT™ Cuts Edge AI Memory and Power Substantially
Ambiq compressionKIT targets edge devices with AI‑based data compression to address memory, power, and transmission constraints in always‑on workloads.
The Chip Insider®–Huawei’s Strategic Assault on Moore’s Law
Huawei promotes advanced packaging as a path beyond Moore’s Law, highlighting scaling limits while raising questions around EDA capabilities and thermal challenges.
Snapdragon Wear Elite Elevates AI and Connectivity
Snapdragon Wear Elite advances Qualcomm’s wearable strategy with 3nm design, on‑device AI, and broader connectivity for premium and new form factors.
How 800V+ Architecture is Redrawing the EV Landscape
EV platforms are shifting to 800–1000V architectures, improving efficiency and charging speed while driving SiC and GaN adoption across power systems.
Narrative: SoC Market Q4 2025 - Chiplets, AI, and 2nm: The Triple Threat shattering the SoC Playbook
SoC market is set to surpass $500B by 2026, driven by AI demand as chiplets, packaging, and IP reshape innovation and global competition.
Analysis: 2026 Q2 China xEV Demand Outlook 2024 to 2033
China xEV outlook remains strong despite uneven NEV demand, rising competition, and export‑driven supply chain localization.
Game Console Shipment Growth Slowed to 4.2% YoY in Q1 2026, with Nintendo Switch 2 Offsetting Sharper Declines of PlayStation and Xbox
Global console outlook shows shifting share as Switch 2 launch masks declines at PlayStation and Xbox amid rising memory costs.
Summary - Apple Vision Pro M5 (A3416) Deep Dive Teardown
A Deep Dive teardown of Apple Vision Pro with M5 highlights internal design, construction, and cost structure for next‑gen AR/VR systems.
Sony LYT-901 Device Essentials Folder
Sony LYT‑901 is a 200 MP smartphone image sensor with 0.70 µm pixels, introducing Quad‑Quad Bayer coding and advanced fabrication features.
HiSilicon T312923 PMIC Floorplan Analysis
Basic floorplan analysis examines HiSilicon T312923 die from Huawei Mate 80 Pro Max, detailing layout within the PMIC component.
Samsung Exynos 2600 (2nm SF2) Process Analysis
Exynos 2600 SoC analysis details 2nm GAA transistor architecture, interconnects, and materials using advanced teardown and microscopy techniques.
STM STWA60N028T 600 V Deep Trench STMesh Super-Junction MOSFET Power Essentials
STMicroelectronics STWA60N028T is a 600 V N‑channel MOSFET using STMESH trench technology, delivering low resistance and high‑efficiency switching.
Mobile Packaging: Markets and Technologies
Mobile processor packaging is evolving with AI‑driven supply shifts, shaping thermal design and architecture across leading smartphone SoCs.
Apple Vision Pro M5 (A3416) Deep Dive Teardown
The Deep Dive dissects Apple Vision Pro with M5, revealing system design, construction, and cost insights through detailed teardown analysis.
Test Probe Card Report
Probe card reports track global market performance, revenues, and share by application, device type, and region with quarterly updates and forecasts.