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Featured Report Analysis

Wearable Battery (Amazon Echo Frames-3rd Gen) Battery Characterization

In addition to the battery essentials report (BEF-2312-801) that recently provided important structural and morphological insights, this report presents a Battery Characterization (BCR) analysis of the Desay 26S1029 Li-ion battery extracted from the Amazon Echo Frames 3rd Generation smart glasses.

July 10, 2024

Analysis - Smartphone Fingerprint Sensor Market Share Q1 2024

The market for smartphone fingerprint sensors secured over 5% revenue growth in Q1 2024. Qualcomm took the top spot followed by Goodix and Egis Technology in the quarter.

July 10, 2024

STMicroelectronics VB1940, VD1940 Standard Floorplan Analysis

Insight into the structure of the STMicroelectronics VB1940 CMOS image sensor ISP die for automotive applications, which is a 5.1 MP, 1/2.5” stacked back-illuminated RGB/NIR technology CIS with a pixel pitch of 2.25 µm.

July 10, 2024

Synaptics VS680 AI SoC Digital Floorplan Analysis

The Synaptics VideoSmart VS680 AI SoC found in Banana Pi BPI-M6 single board computer, using TSMC 12nm CMOS FinFET (likely 12FFC) process.

July 10, 2024

Quectel RG255C-GL 5G Red-Cap Deep Dive Teardown

Quectel announced RG255C-GL module with 5G reduced capacity sub-6GHz on April 9, 2024 designed for global market. It is embedded with Qualcomm Snapdragon SDX35 Baseband Processor and JSFCBA3YH3BBG-425 RAM/NAND memory from Jeju Semiconductor.

July 10, 2024

Tracker: VALUE SHARE: Global Smartwatch Revenue and ASP by OS by Price Tier: 2024 Q1

Global smartwatch revenues fell by 4% YoY during Q1 2024. The decline was driven by slumping shipment volumes and declining ASPs due to macroeconomic weakness and geopolitical uncertainty limiting consumer demand and discretionary spending and causing a lengthening replacement cycle.

July 10, 2024

Tracker: Global Top-500 Smartphone Shipments, ASP, and Price Band by Model with Specs: Q1 2024

The models included in the report cover 90% of the total smartphone shipments in Q1 2024, including all major vendors as well as many locally significant microvendors.

July 10, 2024

Unknown 122B050-A1 SAW Filter (90SSPNWAM) Acoustic Wave Filter Report

This process analysis report examines the TF-SAW filter die, marked 122B050-A1, located in the 90SSPNWAM mid-high band power amplifier with an integrated low noise amplifier and duplexer (MHB L-PAMiD) within the Huawei Nova 12 Pro (ADA-AL00) 5G smartphone.

July 09, 2024

Apple A17 Pro SoC CPU Design Analysis

This report provides an analysis of the standard cells comprising about 70% of the area analyzed in the logic block of the Apple A17 Pro SoC CPU. Standard cells schematics are extracted to determine routing efficiency, gate density and global metal usage survey.

July 09, 2024

HiSilicon Hi1105-GFCV100 Wi-Fi SparkLink SoC Advanced CMOS Process Analysis

The HiSilicon Hi1105GFCV100 WiFi/BT/GNSS SoC was fabricated using HLMC’s 28nm HKMG planar RF CMOS process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.

July 09, 2024

AMD Z1 Extreme APU Digital Floorplan Analysis

This blog compares Samsung’s S6565 and S6566 Wi-Fi 6/BT 5.3/FM SoCs based on the published floorplan and RF architecture analyses. Special attention is given to the die area consumption by the RF sections. Some conclusions are offered based on specific layout changes.

July 09, 2024

Illustrations of the Design Progression from Samsung’s S6565 to their S6566 Wi- Fi 6/ BT 5.3 SoC

This blog compares Samsung’s S6565 and S6566 Wi-Fi 6/BT 5.3/FM SoCs based on the published floorplan and RF architecture analyses. Special attention is given to the die area consumption by the RF sections. Some conclusions are offered based on specific layout changes.

July 09, 2024

Tracker: VALUE SHARE: Global Smartwatch Revenue and ASP by Vendor by Price Tier: 2024 Q1

Global smartwatch revenues shrunk by 1.5% in Q1 2024 due to declining shipment volumes as well as shrinking ASPs caused by macroeconomic weakness and geopolitical uncertainty limiting consumer demand and discretionary spending.

July 09, 2024

Market Model: Automotive Tier 1 Company Quarterly Financials

TechInsights has compiled quarterly financial data for a sampling of Tier 1s important to the automotive industry. All companies selected are public (private companies were not included). Total company revenues (including possibly non-automotive sales if applicable) are listed along with Gross Margins and Operating Margins.

July 09, 2024

Report Overview: HBM and Verticality

TechInsights' report on HBM and Verticality evaluates the impact of High Bandwidth Memory on DRAM die stacking within single accelerator cards as well as how fabs and the supply chain are reacting to this trend.

July 09, 2024

Summary – Nordic nRF54L15 TSMC 22ULL 12 Mb eReRAM Process Analysis

The Nordic nRF54L15 Bluetooth 5.4 Systems-on-Chip (SoC), the first SoC in the nRF54L series which begins sampling in October 2023, features a 128 MHz Arm Cortex-M33 processor, 1.5 MB (equivalent of 12 Mb) of non-volatile memory (NVM) and 256 KB of RAM. The Nordic TMRC83 die is fabricated using TSMC 22 nm ultra-low leakage (22ULL) with embedded resistive random-access memory (eReRAM) process.

July 09, 2024

Qualcomm Snapdragon XR2 Gen 2 (AI Integration) Digital Floorplan Analysis

The Qualcomm Snapdragon XR2 Gen 2 SXR2230P-100-AB (HG11-355514-1) found in the Meta Quest 3 Mixed Reality VR Headset, using Samsung 4nm (4LPX) FInFET high-k metal gate (HKMG) CMOS process. The application processor features Qualcomm Kyro-CPU and Adreno GPU, and LPDDR5x memory controller interfaces to support next-generation MR and VR for all. Explore this digital floorplan analysis (DFR) to find out the process node, BEOL stack, bit cell usage, and manufacturing cost deeply.

July 09, 2024

High demand and poor supply forces cloud providers to make their own silicon to stay relevant

Enterprises are demanding cheaper resources and more AI technology. Cloud providers are struggling to meet these demands using third-party CPU and accelerators vendors which control the supply, cost-base and product definition. To regain control of the main attributes of cloud - scalability and innovation - cloud providers must produce their own silicon.

July 09, 2024

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