February’s update shows tighter industry conditions, led by memory, and pairs with the Industry Performance Data Table for added context.

Advisory Alerts give quick, real‑time insight on semiconductor supply, capacity, and policy changes to help teams navigate a changing market.

Summary teardown of the Oppo A5X 5G, designed with a Mediatek Dimensity 6300.

Q4 2025 China Smartphone Vendor and OS Market Share shows 0.3% decline in YoY smartphone shipments.

Microprocessor report on NXP’s i.MX 952, which features an eIQ Neutron NPU, quad Cortex-A55 application cluster, and a real-time Cortex-M7.

Semiconductor sales were flat week-over-week (ending February 20, 2026), while DRAM and NAND led YoY growth.

Starlink’s strategic acquisition of licensed spectrum from Echostar (pending FCC approval) aims to expand existing capacity for its direct-to-cell (D2C).

Summary of the Deep Dive Teardown of the Fibocom FG332-NA 5G RedCap.

Despite IEEPA “Liberation Day” tariffs, other tariffs remain on the automotive and technology sectors and an uncertain landscape lies ahead.

This report reviews the digital floorplan of Qualcomm’s HG11‑77362‑2 die inside the SM8850, taken from the Xiaomi 17 Pro Max.

iSMARTWARE SW1125 is a GaN‑based flyback PWM converter from the UGREEN 65W charger, adding BOD, X‑cap discharge, EMI tuning, and efficient light‑load modes.

Realme GT7 is a high‑end global phone powered by MediaTek’s Dimensity 9400e, with Deep Dive revealing its design and teardown details.