Deep Dive Teardown of the Honor Magic 6 Pro BLV-AN16 Smartphone

Deep Dive Teardown of the Honor Magic 6 Pro BLV-AN16 Smartphone

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The Honor Magic 6 Pro was equipped with five cameras, with two placed on front, and three on rear of the device, just like its predecessor the Honor Magic 5 Pro. The main difference can be found in the design of the Periscope Telephoto Camera, which in the Magic 6 Pro has a higher resolution of 180MP (in comparison to 50MP in Magic 5 Pro). The dimensions of the Periscope Telephoto Camera Subsystem are increased in newer model (27.78 × 15.97 × 9.26mm in Magic 6 Pro, 25.46 × 12.90 × 7.06 in Magic 5 Pro), also Prism is significantly larger (9.68 × 8.1 × 4.78mm in Magic 6 Pro, 8.16 × 6.26 × 6.23mm in Magic 5 Pro). Despite that, the Honor Magic 6 Pro is 0.54 mm thinner than the Honor Magic 5 Pro (13.80mm versus 14.34 mm).

The Honor Magic 6 Pro shares a similar design of cameras with other, previously reviewed, smartphones. The Wide-Angle Cameras in the Honor Magic 6 Pro and the Xiaomi 14 Pro both use the same OVX9000 50 MP BSI CMOS Image Sensor by OmniVision, also both camera designs use variable aperture and OIS AF, managed by the same ICs provided by Renesas and AKM Semiconductor.

Honor introduced its first RF Enhance Chip, the C1, which debuted in devices such as the Magic5 Pro. Its successor, the Honor Magic 6 Pro, adopts an improved iteration known as the C1+. Surprisingly, both chips contain the same internal die marked as FH01, indicating hardware uniformity. The upgrades in the C1+ version are primarily software-based, with no changes to the underlying hardware. Notably, the die fabrication process utilized 28 nm CMOS technology.

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