Memory Floorplan Report provides detailed device architecture analysis with advanced imaging, node and foundry ID, and die and package cost insights.

Strategic Cost and Price Model updates over the past year focused on 3DNAND, featuring company‑level reviews and analysis.

Infineon ICE186EM integrates flyback SMPS functions in a single package, using CT‑Link to enable isolated communication without an optocoupler.

Current forecasts for Wet Chemicals and Specialty Cleans revenues are projected to reach $6,279 in 2026, reflecting ~9.9% year-over-year growth.

3D NAND roadmap update covering 2yyL devices, and hybrid bonding as Samsung, Micron, KIOXIA/Western Digital, and others advance high speed and density.

TSMC, Samsung, and others drive MRAM and ReRAM innovation, with roadmap coverage for emerging storage NVM devices.

April 2026 automotive electronics review covering EVs, SDVs, autonomy, supplier shifts, battery trends, and semiconductor market dynamics.

AI reshapes hyperscaler strategy in Q1 2026, driving capex growth, supply pressure, and new approaches to revenue, margin, and ROI.

Tablet market Q1 2026 declines as Apple and Lenovo defend share; insights on OEM strategy, shipments, revenue, and supply chain trends.

Explore the Samsung ISOCELL Vizion 931,the first Samsung VDGS CIS analyzed by TechInsights includes a floorplan analysis of the ISP die.

Rivian’s 2026.15 OTA adds its in‑house Rivian Assistant, replacing Alexa with deeper control over drive modes, HVAC, and vehicle data.

May 2026 Android Auto update adds YouTube playback while parked, enhanced Gemini voice controls, and support for diverse display formats.