Introducing TSMC N3E As Seen In Apple M4 SoC

TechInsights shares preliminary results of the Apple M4 analysis on design blocks like GPU and CPU, featuring 2-1 finFLEX and 3-2 finFLEX libraries, respectively. Dive into our on-going analysis and discover the measurements of critical dimensions of TSMC’s 3nm 2nd generation process node: the N3E technology node.
30May

Smartphone Image Sensor Shipments by CIS Model with Specifications: Q1 2024

The global smartphone image sensor market registered over 7% unit growth in Q1 2024. The growth was supported by the revival in market demand, driving the stocking of CIS for customer's new smartphone products. GalaxyCore GC02M1 series dominated shipments followed Samsung S5KJN1 series and Sony IMX714 series, together claiming over 180 million units shipped during the quarter.
29May

Forecast: Automotive Semiconductor and Sensor Demand

This global forecast covers historical and future semiconductor and sensor demand for the automotive industry in USD and units. In 2024, automotive semiconductor demand is forecast to grow by 13% in USD to reach $80 billion; unit growth is expected at 7% surpassing 113 billion.
29May