Microprocessor Report
For more than 30 years, Microprocessor Report (MPR) has been the industry's go-to source for the latest microprocessor news. This subscriber-only publication covers a broad range of semiconductor topics. We publish an average of three new articles per week, each covering a new product, technology, or trend.
Our core coverage is of processors and SoCs for servers, PCs, supercomputers (HPC), smartphones, wearables, embedded systems, IoT devices, communications and networking equipment, and advanced automotive applications. We also cover licensable and open-source cores for CPU, DSP, graphics, and other functions. Many of our recent articles cover AI accelerators for cloud, edge, automotive, mobile, and IoT.
Deep Insight and In-Depth Analysis
Today's complex SoCs contain a variety of functions beyond the processor, so our coverage extends to wired and wireless communications protocols such as 5G, LTE, Ethernet, Wi-Fi, PON, PCI Express, and InfiniBand. We also cover special-purpose chips such as search engines, fabrics, silicon photonics, FPGAs, PHYs, cellular RF, high-bandwidth memory, and new memories such as Optane and NRAM.
We often write about new companies, new technologies, and new design approaches to keep our subscribers up to date on trends. We are particularly interested in new technologies for SoC design and manufacturing. We also keep an eye on mergers and acquisitions, and we use our in-house market-share data to highlight shifts in the market.
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Microprocessor Report
AI Gold Rush Also Boosts Networking
One of the biggest beneficiaries of California’s 1849 gold rush wasn’t a miner, but Levi Strauss, who famously sold the miners clothing.
Broadcom Retargets Jericho at AI Clusters
Broadcom is challenging the conventional topology linking AI engines in training supercomputers/clusters, offering a version of its Jericho Ethernet switch chip set for AI.
Hailo Releases Second-Generation Chip
Israeli startup Hailo has released the Hailo 15, its second-generation chip for smart cameras. Hailo 15 is a standalone processor with an AI engine and comes in three variants ranging from 7 to 20 TOPS.
TPUv4 Interconnect Cuts Cost, Power
Google employs optical interconnect when building a 4,096-node AI supercomputer featuring its TPUv4 accelerator chip. The result is much higher potential performance coupled with a sharp drop in carbon emissions.
Dimensity 9200 Gets a Boost
The Dimensity 9200+ is a midlife kicker for MediaTek’s flagship smartphone processor, offering 5–10% more CPU and graphics performance than the original 9200. The company also renamed its low-end 5G products.Sign up for latest analysis, news and insights from TechInsights!
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