Latest Blogs and Commentary
China Smartphone Vendor and OS Marketshare: Q3 2023
China smartphone shipments declined -5% YoY in Q3 2023. It has been 10 consecutive quarters that China market posted annual decline by volume, blaming to the softened consumer demand and mixed economic outlook.
Global Smartphone Top 100+ Microvendors Market Share : Q3 2023
A huge number of second-tier MICROVENDORS were playing a meaningful role in the global smartphone market. However, industry consolidation is underway and major players are taking more shares from small vendors recent years.
MediaTek MT6308MP Envelope Tracking Power Supply Floorplan Analysis (RFEF)
This report presents a Basic Floorplan Analysis of the MediaTek BN10712DW found inside MediaTek MT6308MP. The MT6308MP was extracted from the Samsung Galaxy A14.
Qualcomm QET4101 Average Power Tracker Floorplan Analysis (RFEF)
The Qualcomm QET4101 component has been a regular part found in several recent Chinese smartphones, which warranted the need to decap a QET4101 sample to confirm whether it was different from the previously QET4100 counterpart.
SK hynix H58G66AK6H-X132 1z nm 16 Gb LPDDR5 DRAM Memory Floorplan Analysis
This report presents a Memory Floorplan Analysis of the SK Hynix MDHD5E_20104 die found inside SK Hynix H58G66AK6H-X132. The H58G66AK6H-X132 was extracted from the Apple iPhone 15 Pro 5G smartphone.
Apple’s “Scary Fast” Event Should Scare the PC Industry
Apple's "Scary Fast" event introduced the M3 chip family, offering exceptional speed and performance, challenging Intel, and targeting the commercial market. This innovation sets the stage for Apple's competitive edge in the PC industry's resurgence in 2024.
MicroBT KF1978E Whatsminer M56S++ Samsung SF3E Process Flow Analysis
This report provides an analysis of the process flow and integration used in the manufacture of the MicroBT KF1978E ASIC die found in the WhatsMiner M56S++ cryptocurrency miner, the first known commercially available device to use gate-all-around (GAA) transistors.
STMicroelectronics VB1940, 1/2.5″ Format, 5.1MP Resolution, 2.25μm Pixel Pitch, Stacked Back-Illuminated RGB/NIR CMOS Image Sensor Device Essentials Folder
This device essentials folder (DEF) presents the STMicroelectronics VB1940, 1/2.5″ Format, 5.1 MP Resolution, 2.25 µm Pixel Pitch, Stacked Back-Illuminated RGB/NIR CMOS Image Sensor for Automotive Applications.
North America Smartphone Vendor & OS Market Share by Country: Q3 2023
Growth in the North American smartphone market declined in Q3 2023, but by a lower margin than in previous recent quarters. Seven of the Top-10 brands recorded negative annual shipment growth.
UX Benchmark: 23MY BMW i7
TechInsights conducted an evaluation of the infotainment system in the 23MY BMW i7. As consumers expect from the brand, it is packed full of technology and has won number of awards.
India Smartphone Vendor and OS Marketshare: Q3 2023
Smartphone market in India declined by -5% annually and grew 26% sequentially in Q3 2023. Xiaomi topped and was followed by Samsung and Vivo in the second and third positions.
Global Smartphone Market Shows Signs of Stability: Q3 2023 Insights
The global smartphone market saw a notable shift in Q3 2023, marked by the ninth consecutive quarter of annual shipment declines. However, there are signs of market stabilization, offering hope for a mild rebound in 2024, with implications for industry players and consumers.
D-Matrix Samples AI Chiplet
Silicon Valley startup D-Matrix is trying to accelerate LLMs with its digital in-memory compute (DIMC) chip. The company’s Corsair card provides up to 9,600 TOPS at 600 W.
Qualcomm’s Oryon CPU Powers Laptops
Qualcomm’s new Snapdragon X Elite for laptops finally achieves competitive Arm-architecture performance while keeping power low. It’s the company’s first use of its Nuvia-originated CPU.
Snapdragon 8 Gen 3 Runs BIG AI Models
Qualcomm’s Snapdragon 8 Gen 3 uses more, faster CPUs and fewer power-efficient CPUs to boost performance. The company’s glitzy AI demos highlight’s what’s now possible on a phone.
Editorial: RISC-V Is The New AI
AI-chip startups raised billions of dollars in prior years, but this year investors turned their attention to RISC-V startups. The new instruction set faces both technical and business challenges.
AMD Ryzen 9 7950X3D 3D Vertical Cache TSMC N7HPC FinFET Process Digital Floorplan Analysis
This is a Digital Floorplan Analysis (DFR) of the AMD DGX3D cache die found inside the AMD Ryzen 9 7950X3D desktop processor component.
Deep Dive Teardown of the Huawei Mate 60 Pro ALN-AL00 Smartphone
The Huawei Mate 60 Pro is powered by Octa-Core HiSilicon Kirin 9000S Octa-Core Applications/Baseband Processor. For more information about the processor please look at the Digital Floorplan Analysis (DFR-2309-801) report.