Inside G. Dan Hutcheson’s latest analysis: Revenue per wafer is the key to semiconductor profitability, and six decades of tighter process control have reduced variability 113-fold, helping make today’s AI infrastructure affordable.
The question sounds as though it should have a simple answer: select the accelerator, look up its power consumption, and calculate the emissions. Real AI infrastructure does not work that way.
TechInsights 2027 compute outlook: how HBM, advanced packaging, SRAM limits and workload-specific design will decide processor and AI accelerator supply.
TechInsights confirms Huawei subsidiary HiSilicon's 50 MP CS5250 CMOS image sensor in the Xiaotu S7 PRO MAX action camera. Explore preliminary teardown findings and learn how to access the full technical analysis.
Explore five trends shaping semiconductor manufacturing in 2027, including 27% capex growth, HBM’s impact on memory supply, packaging bottlenecks, 2 nm capacity and rising emissions.
Advanced packaging will cap semiconductor growth in 2027. Explore how CoWoS, HBM4 and chiplets are reshaping capacity, yields and supply-chain strategy for AI accelerators.
The global cloud market reached $167.7 billion in Q3 2026, growing 55% year over year as AI demand and neocloud providers reshape the market. See this quarter's trends.
Inside G. Dan Hutcheson’s latest analysis: More than 35,000 attendees examined shared industry challenges from geopolitics, power, and water to workforce, while big questions surfaced around CXMT’s DRAM, Terafab’s EUV access, and the next downturn.
Memory will account for 62% of semiconductor revenue in 2027, as HBM demand, tightening NAND supply and capacity constraints reshape pricing, products and investment.
AI architectures are diversifying as inference, memory innovation, and new integration approaches change packaging requirements. TechInsights examines what these shifts could mean for advanced packaging suppliers.
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