Latest Blogs and Commentary
Qorvo QM35725 UWB SoC (D1QM3572003 die) Floorplan Analysis (IoTB)
The Qorvo QM35725 is an Ultra-Wideband (UWB) SoC that has been found in Google GC3VE (Pixel 8 Pro).
Sony ISP from IMX591, 10.1μm Pixel Pitch, 0.01MP, Stacked Back-Illuminated Direct-Time of Flight (d-ToF) SPAD Sensor Advanced Floorplan Analysis
The Sony IMX591 is a Time-of-Flight (ToF) sensor used in the LiDAR scanner of the iPhone 15 Pro and Pro Max. The sensor has a resolution of 0.01 megapixels and a pixel pitch of 10.1 microns. The IMX591 die incorporates inverted pyramid structures on the rear side of the CIS active Si, as well as tungsten (W)-filled full depth back deep trench isolation (B-DTI) and composite metal grid (CMG).
UX Benchmark: 23MY Range Rover Sport
TechInsights conducted an evaluation of the infotainment system in the 23MY Range Rover Sport. Land Rover have been striving to add a touch of modernity to their luxury SUV brand image.
Analyst Predictions For 2024
As we prepare to enter 2024, we make predictions involving CPUs, AI, memory, and more. The year will be notable both for what might not happen and for what will.
Deep Dive Teardown of the Roku Streaming Stick 4K+ 2821R2 Streaming Media Stick
Several manufacturers share design Wins for the Roku Streaming Stick 4K+ 3821R2. The main SoC came from Realtek. For this device, Samsung supplied 1 GB LPDDR4 SDRAM. Whereas NAND memory comes from Kioxia and offers 4 GB MLC NAND Flash. Connectivity is supported by Realtek WiFi/BT transceivers.
Maxscend MXD9122C 5G NR RxD FEM IPD Band Pass Filter Die Process Analysis
This report contains the results of the process and circuit analysis of the integrated passive device (IPD) filter die from the Maxscend MXD9122C 5G NR diversity receive (RxD) front end module (FEM). Maxscend Microelectronics Company Limited operates as an electrical component manufacturing company.
Navitas Semiconductor NV6245C 650V 275mΩ E-Mode GaN-on-Silicon HEMT Power Essentials Summary
This report presents a Power Essentials analysis of the Navitas Semiconductor NV6245C device found in the Baseus 130 W GaN5 Pro Charger. NV6245C, as one of the initial family of GaNSense half-bridge ICs, includes two GaN power high electron mobility transistors (HEMTs) dies and two silicon (Si) gate driver dies.
Renesas R7F702300BFABA-C TSMC 28 nm eFlash Memory Floorplan Analysis
This is a Memory Floorplan Analysis (MFR) of the TSMC R7F702300B die with a memory capacity of 16 MB and 28 nm HPL technology. Within the eFlash macro, memory sub-arrays take about 69% of the area, while memory array with array peripherals covers about 84% of the macro space.
UK Handset Vendor Marketshare by Operator: Q3 2023
We estimate 4.9 million handsets were shipped in the UK in Q3 2023, dipping by -9% YoY. Apple maintained its position as the number one handset vendor across all four major UK operators during the quarter, largely boosted by the strong demand of the iPhone 14 / 15 series.
Deep Dive Teardown of the One-Notebook OneXPlayer 2 Pro Handheld Game Console
The OneXPlayer2 Pro is a portable game console that is equipped with the Windows 11 operating system, offering great functionalities like those found in tablets or laptops.
Intel SRMJF Xeon CPU Max 9462 Processor with Intel EMIB and Samsung HBM2e Technology Advanced Packaging Quick Look
This Advanced Packaging Quick Look (APQ) for the Intel Xeon CPU Max 9462 processor, provided as a companion deliverable for APQ-2308-801 projects.
Global Wearables Microvendor Market Share: Q3 2023
A huge number of second-tier MICROVENDORS are playing a meaningful role in the global wearables market, flooding the market with new, niche, and segmented offerings.
Global Cellular Smartwatch Vendor Market Share: Q1 2017 to Q3 2023
Global cellular smartwatch shipments grew 4% YoY in the third quarter of 2023 despite a modest total smartwatch market decline, as cellular penetration rose due to the Apple Watch Ultra and Google Pixel Watch.
Unknown Manufacturer S111131C 2+66 Surface Acoustic Wave (SAW) Filter Process Analysis
This report contains the results of the process analysis of the unknown manufacturer surface acoustic wave resonator (SAW) filter die S111131C 2+66 from the S111131C RF front-end (RFFE) module.
Semiconductor Sales Grew 6% YoY the Week Ending Dec 8, 2023
TechInsights' Semiconductor Analytics Report
Deep Dive Teardown of the Google Pixel Watch 2 LTE GC3G8 Smartwatch
The Google Pixel Watch 2 LTE GC3G8 is the improved successor to the Google Pixel Watch GWT9R. The latest Google smartwatch is available in two variants 4G LTE + Bluetooth/WiFi or Bluetooth/WiFi. The Google Pixel Watch 2 LTE GC3G8 is based on Wear OS 4.0, like its predecessor GWT9R.
Apple Watch Metal-Can Battery
Dive deep into the heart of your Apple Watch with our exclusive webinar, "Understanding the Apple Watch Metal Can Battery: Design, Characterization, and Cycle Life," featuring TechInsights' Subject Matter Expert, Ali Khazaeli.
Consumer Electronics Video Series Part 2: Connected Entertainment
Will the Smart TV operating system arena see the emergence of new entrants? What new OEM/streaming platform partnerships will emerge, and which companies will be best placed for growth in 2024?
Pagination
- Previous page
- Page 37
- Next page