Featured Report Analysis
Market Data: Tablets
Reports deliver tactical tablet market data and forecasts, tracking shipments, share, and outlooks by OEM, OS, region, and form factor.
Samsung SmartThings Integrates with IKEA’s Smart Home Devices
SmartThings integrated with 25 IKEA Matter‑over‑Thread devices, expanding support across lighting, sensors, plugs, and smart home controls.
Apple's CEO Change: Speed, Privacy, and the Timing Challenge
Apple will transition leadership to John Ternus in September 2026, marking the company’s first CEO change in nearly 15 years.
Realme P4 Power - Teardown Video
Realme P4 Power launches in India on MediaTek Dimensity 7400 Ultra, delivering battery performance that rivals many high‑end smartphones.
Realme P4 Power - Unboxing Video
Realme P4 Power launches in India on MediaTek Dimensity 7400 Ultra, offering 80W UltraCharging that requires a matched charger and cable.
Further Chinese OEM-Semiconductor Partnership, Geely-UNISOC
UNISOC announced a Joint Innovation Laboratory with Geely Auto at its Ningbo research institute to advance automotive semiconductor collaboration.
Preliminary Q1 2026 Smartphone Shipments
Q1 2026 smartphone shipments fell 5.5% YoY, with Apple up 9% as memory costs hit low‑end vendors and BOM‑driven stratification persists.
SK hynix H25GTD0 321L 1 Tb TLC 3D NAND Memory Floorplan Analysis
Memory Floorplan Report analyzes device architecture with advanced imaging, identifies node and foundry, measures dimensions, and assesses die and package costs.
2025 Aito M9 Side LiDAR Design Material Assembly
DMA report details materials, assembly, and construction of the 2025 Aito M9, including its multi‑LiDAR layout with roof and fender‑integrated sensors.
2025 Aito M9 Side LiDAR Deep Dive Teardown
The 2025 Aito M9 features a multi‑LiDAR layout, combining one roof‑mounted long‑range unit with three short‑range sensors for blind‑spot and close‑range coverage.
2026 Compute – SoC Design Analysis Briefing 1
Report reviews the Logic Technology Roadmap and analyzes technology scaling at Intel, MediaTek, Apple, Qualcomm, and HiSilicon.
Summary – Apple A19 Pro SoC (TSMC N3P) GPU SoC Design Analysis
SoC Design Analysis reviews the TMUA28 die inside Apple’s A19 Pro, covering digital library cells, metal power rails, routing, and dummy cell features.
Apple A19 Pro SoC (TSMC N3P) GPU SoC Design Analysis
SoC Design Analysis examines the TMUA28 die in Apple A19 Pro, detailing digital library cells, power rail structures, and routing efficiency.
Company Earnings: ASML
Reports extracts key demand and supply insights from ASML’s quarterly earnings calls.
Insight: China's AI Chip Challenge: Closing the Gap Without Cutting-Edge Manufacturing
Analysis explores whether China can build competitive AI accelerators as US‑China rivalry deepens and export controls limit access to advanced fabrication.
Insight: Why AI is rapidly rewriting the PSU BoM?
Report analyzes power shelf evolution toward three‑phase and high‑voltage designs, highlighting impacts on PSU topology, semiconductor content, and the resulting bill of materials.
Analysis: Order Activity Stabilizes After Slight Cooldown
TSMC lifted its 2026 outlook to 30%+ revenue growth with capex at the top of its $52–$56B range, driven by AI chip demand despite supply risks.
Global Handset Smartphone Feature Phone Sales Forecast for 88 Countries: 2007 to 2031
Global smartphone sales rose 0.7% to 1.17B in 2025, but higher prices cut the 2026 forecast to 1.10B before modest growth resumes.