Latest Blogs and Commentary
Samsung K9DYGY8J5B-CCK0 236-Layers 3D NAND Flash Memory Floorplan Analysis
Ten months after Samsung’s 236-Layer (V8) TLC Vertical NAND (V-NAND) mass production milestone in November 2022, the 4 TB SSD 990 PRO is announced, in September 2023. This report presents a Memory Floorplan Analysis of the Samsung K9AKGD8J0B die found inside the Samsung K9DYGY8J5B-CCK0 package. The K9DYGY8J5B-CCK0 was extracted from the Samsung MZ-V9P4T0 990 PRO 4 TB SSD.
Deep Dive Teardown of the Google Pixel 8 Pro GC3VE Smartphone
The Google Pixel 8 Pro launched in 2023. It was announced on October 4, 2023, and was available on October 12, 2023. The GC3VE model is suitable for European and Indian markets. The Google Pixel 8 Pro has several improvements regarding its cameras compared to its predecessor.
Deep Dive Teardown of the Kioxia XD6 KXD6CRJJ3T84 SSD
The memory: non-volatile, logic, substrates and memory: volatile category had the greatest impact on the total estimated constructions cost. The cost of each category consists of: -memory: non-volatile ($190.74 –8x 512 GB 3D TLC NAND Flash), -logic ($12.04 –NVMeSSD controller), -substrates ($5.29 –main board), -memory: volatile ($6.54 –2 GB LPDDR4 SDRAM).
Autonomous Vehicles and Sensors Market Scenarios Comparison
This annual update to TechInsights Autonomous Vehicles and Sensors Market Scenarios sees a boost for the expected penetration of L3 vehicles, but a small delay to the predicted adoption of fully autonomous L4 solutions.
TechInsights Forecasts that Consumer Electronics Industry Revenues Will Exceed One Trillion Dollars in 2024
TechInsights forecasts a historic moment for the Consumer Electronics industry, projecting it to exceed one trillion dollars in revenues for the first time in 2024. This blog post offers a concise overview of the key insights and trends shaping this groundbreaking forecast.
Automotive Video Series Part 2: LiDAR's Last Hurrah, 2024 Market Shakeup & Apple's EV Power Play
Renowned automotive analysts Asif Anwar and Mark Fitzgerald take center stage to discuss the imminent transformation of LiDAR technology and unveil Apple's pioneering strides in the electric vehicle (EV) realm.
3Q 2023 Smartphone AP Market Tracker
The global smartphone applications processor (AP) market gained 2% year-on-year in unit growth during Q3 2023 hinting at the anticipated industry recovery. The smartphone market received a seasonal boost from the latest Apple iPhone 15 series release.
Consumer Electronics Industry Revenues to Exceed $1 Trillion in 2024
Global consumer electronics market revenues are set to break through the one trillion dollar barrier in 2024. This is a significant milestone for the industry and comes at a time of pivotal change and innovation.
OECD Fixed Broadband Price Benchmarking Q3 2023
The Q3 2023 update of the OECD Fixed Broadband Price Benchmarking service is now available for download and includes over 2,600 fixed broadband tariff plans from more than 120 providers across 38 OECD countries.
Sony IMX591, 0.01MP Resolution, 10.1μm Pixel Pitch, Stacked Back-Illuminated Direct-Time of Flight (d-ToF) SPAD Sensor (iPhone 15 Pro Max LIDAR) Device Essentials Plus
This is a Device Essentials Plus (DEP) analysis of the IMX591, 0.01 MP resolution, 10.1 µm pixel pitch, stacked back-illuminated direct-time of flight (d-ToF) SPAD sensor from Apple iPhone 15 Pro/Pro Max LiDAR camera.
Qorvo QM35725 UWB SoC (D1QM3572003 die) Floorplan Analysis (IoTB)
The Qorvo QM35725 is an Ultra-Wideband (UWB) SoC that has been found in Google GC3VE (Pixel 8 Pro).
Sony ISP from IMX591, 10.1μm Pixel Pitch, 0.01MP, Stacked Back-Illuminated Direct-Time of Flight (d-ToF) SPAD Sensor Advanced Floorplan Analysis
The Sony IMX591 is a Time-of-Flight (ToF) sensor used in the LiDAR scanner of the iPhone 15 Pro and Pro Max. The sensor has a resolution of 0.01 megapixels and a pixel pitch of 10.1 microns. The IMX591 die incorporates inverted pyramid structures on the rear side of the CIS active Si, as well as tungsten (W)-filled full depth back deep trench isolation (B-DTI) and composite metal grid (CMG).
UX Benchmark: 23MY Range Rover Sport
TechInsights conducted an evaluation of the infotainment system in the 23MY Range Rover Sport. Land Rover have been striving to add a touch of modernity to their luxury SUV brand image.
Analyst Predictions For 2024
As we prepare to enter 2024, we make predictions involving CPUs, AI, memory, and more. The year will be notable both for what might not happen and for what will.
Deep Dive Teardown of the Roku Streaming Stick 4K+ 2821R2 Streaming Media Stick
Several manufacturers share design Wins for the Roku Streaming Stick 4K+ 3821R2. The main SoC came from Realtek. For this device, Samsung supplied 1 GB LPDDR4 SDRAM. Whereas NAND memory comes from Kioxia and offers 4 GB MLC NAND Flash. Connectivity is supported by Realtek WiFi/BT transceivers.
Maxscend MXD9122C 5G NR RxD FEM IPD Band Pass Filter Die Process Analysis
This report contains the results of the process and circuit analysis of the integrated passive device (IPD) filter die from the Maxscend MXD9122C 5G NR diversity receive (RxD) front end module (FEM). Maxscend Microelectronics Company Limited operates as an electrical component manufacturing company.
Navitas Semiconductor NV6245C 650V 275mΩ E-Mode GaN-on-Silicon HEMT Power Essentials Summary
This report presents a Power Essentials analysis of the Navitas Semiconductor NV6245C device found in the Baseus 130 W GaN5 Pro Charger. NV6245C, as one of the initial family of GaNSense half-bridge ICs, includes two GaN power high electron mobility transistors (HEMTs) dies and two silicon (Si) gate driver dies.
Renesas R7F702300BFABA-C TSMC 28 nm eFlash Memory Floorplan Analysis
This is a Memory Floorplan Analysis (MFR) of the TSMC R7F702300B die with a memory capacity of 16 MB and 28 nm HPL technology. Within the eFlash macro, memory sub-arrays take about 69% of the area, while memory array with array peripherals covers about 84% of the macro space.
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