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  1. Home

Latest Blogs and Commentary

August 08, 2023

Sony ISP from 1.12 μm Pixel Pitch, 48 MP, Stacked Back-Illuminated CMOS Image Sensor (Sony Xperia 1 V 5G) Advanced Floorplan Analysis

This report presents an image signal processor advanced floorplan analysis (ISP) of the Sony ISP from 1.12 μm Pixel Pitch, 48 MP, Stacked Back-Illuminated CMOS Image Sensor, extracted from the Sony Xperia 1 V 5G rear-facing wide-angle camera.

August 08, 2023

Deep Dive Teardown of the HesaiTech Li Auto X01 LiDAR AT-128 Automotive

Hesai's AT128 is a hybrid solid-state directional LiDAR. It has many similarities to the LeiShen CH128X1 LiDAR we analyzed. Hesai’s LiDAR shares the same number of transmitting channels but is equipped with only 32 laser transmitters and receivers.

August 08, 2023

Xinguan Technology XG65T230HS1B650 V 230 mΩ GaN-on-Silicon Depletion Mode HEMT (Satechi 200 W USB-C Charger) Power Essentials Analysis

This report presents a power essentials summary (PEG) of the Xinguan Technology XG65T230HS1B650 V 230 mΩ GaN-on-Silicon Depletion Mode HEMT, extracted from the Satechi 200 W USB-C Charger.

August 08, 2023

Amperex Technology Limited (ATL) BLP973 Lithium-Ion Battery with Battery Health Engine (Oppo Reno 9 Pro) Battery Characterization

This report presents a battery characterization (BCR) of the Amperex Technology Limited (ATL) BLP973 Lithium-Ion Battery with Battery Health Engine, extracted from the Oppo Reno 9 Pro smartphone.

Component Price Analyzer (CPA) tool

August 03, 2023

Component Price Analyzer (CPA) tool

Welcome to the TechInsights Component Price Analyzer (CPA) tool. Our CPA tool is specifically designed for customers in the field of electrical engineering to analyze their bills of materials (BOMs).

August 03, 2023

Toshiba GT30J65MRB 650 V 60 A 7th Generation Silicon Enhancement Mode N-Channel Reverse Conducting IGBT Power Essentials

This report presents a power essentials analysis (PEF) of the Toshiba GT30J65MRB 650 V 60 A 7th Generation Silicon Enhancement Mode N-Channel Reverse Conducting IGBT, featuring IGBT technology with optimized trench structure and frequency capability up to 60 kHz (from 40 kHz of previous generation).

August 03, 2023

Deep Dive Teardown of the Aqara Smart Video Doorbell G4 SVD-C01 Digital Imaging

The Aqara Smart Video Doorbell G4 is a smart video doorbell capable of face recognition. It is similar in size and overall functionality when compared to the Ring Doorbells (Doorbell Pro 2 and Video Doorbell Pro).

August 03, 2023

India Smartphone Vendor and OS Marketshare: Q2 2023

Smartphone market in India declined by -5% annually and grew 12% sequentially in Q2 2023. Vivo topped for the second time ever and was followed by Xiaomi and Samsung in the second and third positions.

August 03, 2023

RF Industry Review Q2 2023: Financials

Sales declined for almost three quarters of publicly traded RF & wireless semiconductor suppliers and profitability, as defined by net income divided by sales, fell precipitously.

August 03, 2023

V2X 2023 Update: China Dominates the Market While the Rest of the World Awaits Regulation Clarity

This report examines and forecasts the global market for V2V (Vehicle to Vehicle) communication and the continued rivalry between two V2X protocols: Wi-Fi-p/DSRC/ITS-G5 and cellular based C-V2X.

August 03, 2023

Autonomous Vehicle Start-ups & Small Companies

This database covers the key start-ups and small companies that collectively are playing an important role in the development of autonomous vehicle technology.

Do we need a 1Tb DRAM chip?

August 02, 2023

Unleashing the Future of DRAM: The Quest for 1Tb Chips with 3D X-DRAM

Are we ready for a groundbreaking leap in memory capacity? Dr. Jeongdong Choe explores the possibility of a 1Tb DRAM chip, akin to NAND, and unveils the potential of 3D X-DRAM in the latest TechStream article.

PMIC Process Analysis Analyst Briefing

August 02, 2023

PMIC Process Analysis Analyst Briefing

>In power semiconductors, we are seeing emerging competitive devices from China-based manufacturers such as Southchip (PMICs) and Innoscience (GaN) with close collaboration evident between these device design/manufacturers and downstream vendors such as BBK Electronics and Xiaomi.

August 02, 2023

Deep Dive Teardown of the Fire-Boltt King BSW159 Smartwatch

The Fire-Boltt King is low budget smartwatch with a very simple design. Operation is by touchscreen and only one button. Connectivity is only via Bluetooth, there is no WiFi.

August 01, 2023

Deep Dive Teardown of the Wyze Labs Inc Mesh Router Pro WF6ETBMR WiFi Router

The Wyze Mesh Router Pro has six antennas (compared to four in Google Nest WiFi Router and the same as in Google Nest WiFi Pro), supports Bluetooth 5.1 and Zigbee protocol (same as in Google Nest WiFi Pro Router), and uses IPQ5018 WiFi SoC (same as in Google Nest WiFi Pro Router).

August 01, 2023

Survey Plus Teardown of the Huawei Nova 11 LTE FOA-AL00 Smartphone

The Nova 11 is the newest addition to Huawei’s mid-range nova Series, that launched in 2023 alongside the 11 Pro and 11i, among which it’s a mid-line model.

August 01, 2023

Survey Plus Teardown of the Samsung A24 SM-A245/DSN Smartphone

Our analysis shows that most smartphones have a front camera with a sensor equal to or larger than 12 MP. We analyzed several smartphones that have a smaller sensor than 12 MP.

August 01, 2023

VanChip VC7643-63/H Multi-Mode Multi-Band (MMMB) Power Amplifier (PAM) Module Architecture Analysis

The following is a report of the VanChip VC7643-63/H Multi-Mode Multi-Band (MMMB) Power Amplifier Module (PAM) Architecture Analysis.

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