There are expectations that Huawei will move away from SONY to use made-in-China image sensors in the Pura 70 series. This report provides insight into the image sensors used in the Huawei Pura 70 series.
The Hi-5021Q is a 50 MP, 0.70 µm stacked back illuminated CMOS image sensor. It is the first SK hynix image sensor analyzed by TechInsights to use hybrid bond to connect the CIS and ISP dies. This is also the first commercially available image sensor to use an air gap grid.
The Sony LYTIA LYT900 is a rear wide-angle camera module that was extracted from the Oppo Find X7 Ultra (PHY110) smartphone. The camera module measures 27.96 mm × 31.16 mm × 10.68 mm thick. It contains a stacked imager comprising a CIS die and an ISP die. This floorplan analysis (FAR) examines the ISP die.
The STMicroelectronics Ouster L3 Chip with 10 µm pixel pitch is the third-generation LIDAR chip. It is a stacked back-illuminated direct Time-of-Flight (d-ToF) SPAD sensor, which competes directly with the SONY IMX459. The L3 SPAD chip has many innovations, including hybrid bonding, in die quench resistor, dual DTI pixel isolation, finger capacitor, and diffraction grating.
The OmniVision OV50K CMOS image sensor (CIS) was extracted from the Honor Magic 6 Pro smartphone (BVL-AN16). The OmniVision OV50K is a Quad Bayer color, 50 MP, stacked back-illuminated (BI) electronic rolling shutter CIS utilizing the PureCel Plus-S technology for mobile cameras. This device essentials (DEF) report examines both the CIS and image signal processor (ISP) die.