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Latest Blogs and Commentary

Unlock the Future of Advanced Packaging A Deep Dive into Hybrid Bonding

April 14, 2025

Unlock the Future of Advanced Packaging: A Deep Dive into Hybrid Bonding

Discover how hybrid bonding is revolutionizing semiconductor packaging and driving the future of high-performance, low-power devices.

NVIDIA HGX B200 Analysis

April 14, 2025

TechInsights’ NVIDIA HGX B200 Analysis Reveals HBM3E Supplier and Advanced Packaging Innovation

Explore TechInsights’ early analysis of NVIDIA’s HGX B200 AI accelerator, revealing SK hynix as the HBM3E supplier and showcasing the first commercial use of TSMC’s CoWoS-L packaging.

April 12, 2025

Smartphones and some electronic devices are exempted from the reciprocal tariffs, headwinds on demand side remain

April 11, 2025

Semiconductor Analytics – April 9, 2025

Weekly semiconductor sales rose YoY as of April 4, 2025. Track trends in DRAM, NAND, Logic, Analog, Power & Auto ICs with our analytics platform.

April 11, 2025

Data Center AI Processor Chips and Accelerators: 2025 Q1 Update

AI processor & accelerator market to hit $457B by 2030, led by GPUs, AI ASICs & ARM CPUs. Generative AI drives 23% CAGR across data centers.

April 11, 2025

Infineon IPW60R016CM8 600 V 16 mΩ CoolMOS 8 SJ-MOSFET Power Essentials

Explore Infineon's IPW60R016CM8 CoolMOS™ 8 SJ-MOSFET—600 V, 13 mΩ RDS(ON), 123 A—designed for high-efficiency, compact power switching applications.

April 11, 2025

CXMT G4 16Gb DDR5 DRAM Process Analysis

Detailed analysis of the Powev H2G08SC522-6AF Die with SEM/TEM insights into CXMT G4 16Gb DDR5 DRAM structure, materials, and key findings.

April 11, 2025

Insight: Smart TV by OS Forecast 2025-2030

The adoption of smart TVs is set to surge in the next five years, explore the 2025-2030 trend forecast including key takeaways and critical implications.

April 11, 2025

SEMI equipment sales left 2024 with strong growth continuing to see it in 2025

Data-driven reports on 160+ subsystem suppliers with insights on CSUB devices, ESCs, CMP, Si, SiC, quartz, and more—plus visual summaries.

Majority of Emissions from Semiconductor Manufacturing Come from the Fabrication of Die

April 11, 2025

Majority of Emissions from Semiconductor Manufacturing Come from the Fabrication of Die

Semiconductor manufacturing is highly carbon-intensive, with wafer fabrication producing the majority of emissions compared to packaging.

April 11, 2025

Lucid Acquires Nikola Facilities in Strategic Move Toward Market Expansion

April 11, 2025

Omnivision Introduces its Largest 50MP 1-inch Image Sensor for Mobile Applications

April 10, 2025

2025-04-08 - Fourth Quarter Inventory Update

Access in-depth reports on market insights, data analysis, and key findings on over 160 suppliers. Includes visual graphs and detailed assessments of CSUB devices.

April 10, 2025

RISC-V-based Dongfeng Motor's DF30 MCU Entering Mass Production

April 10, 2025

Analysis: Wafer Demand Increasing on AI Initiatives in 2025

The semiconductor industry faces weakness in consumer and automotive markets, while AI drives GPU and HBM demand. Read the Wafer Demand Q1 2025 update.

April 10, 2025

Melexis MLX90632 Digital Infrared Thermometer IC Device Essentials Folder

Discover the Melexis MLX90632 digital thermometer with MEMS thermopiles. Explore its fabrication process and salient features in this detailed analysis.

April 10, 2025

Wafer Level Packaging Equipment – April 7, 2025

Discover TechInsights' comprehensive report on Wafer Fab Equipment and Advanced Packaging, with historical sales data and 5-year forecasts for key market segments.

April 10, 2025

Leapmotor Forming L3 Autonomous Driving Team in Europe

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