Latest Blogs and Commentary
ODM sales soar as hyperscalers and cloud providers go direct
TechInsights' 2023 server market analysis shows that the world spent $120 billion on over 13.5M servers in 2023. Original design manufacturers (ODMs) now represent 40% of direct server sales.
Complimentary – ODM sales soar as hyperscalers and cloud providers go direct
TechInsights' 2023 server market analysis shows that the world spent $120 billion on over 13.5M servers in 2023. Original design manufacturers (ODMs) now represent 40% of direct server sales.
AWS NVIDIA shortages demonstrate need for custom silicon
AWS NVIDIA shortages demonstrate need for custom silicon Share This Post Our research shows that even Amazon Web Services can’t get access to the latest NVIDIA technology. For a week, TechInsights probed AWS to see what accelerators were available in
Complimentary – AWS NVIDIA shortages demonstrate need for custom silicon
Our research shows that even Amazon Web Services can’t get access to the latest NVIDIA technology. For a week, TechInsights probed AWS to see what accelerators were available in what regions.
Global Smartphone Foldable Display Forecasts to 2029
The display is the main technology that defines usability and perceived quality of a smartphone. Foldable displays are the latest new display technology that has emerged for smartphones.
TaiXin Semiconductor TXW8301 Wi-Fi HaLow SoC Floorplan Analysis
The TXW8301 is a Wi-Fi HaLow system on chip (SoC). Wi-Fi HaLow is a long-range implementation of Wi-Fi technology based in the 750-950 MHz spectrum with low power and long range, introduced by WiFi Alliance and IEEE.
Baseband Market Share Model Q1 2024: Optimism Returns as 5G Poised to Overtake LTE
The global cellular baseband processor market grew 5 percent year-on-year (volume shipments) in Q1 2024 as the industry continues to recover from the disruptive inventory adjustments that plagued the industry in 2023.
Global Bluetooth Headset Sales, Installed Based and Revenue Forecast to 2028
Bluetooth headset revenues will grow slightly, driven by TWS headsets but also banded headsets. In 2022 growth slowed due to the economic downturn, but the BT HS market remains a growing industry.
Report Overview: Resideo Buys Snap One
The consolidation of the smart home market was impacted by Resideo’s recent acquisition of Snap One in April 2024. Resideo’s ADI Global Distribution and Snap one have combined forces to bring the power of choice to professional installers and integrators.
AMD Ryzen 9 7950X3D Advanced CMOS Process Analysis
This report provides an analysis of the structure and materials used in the manufacture of the of the AMD Ryzen 9 7950X3D CCD (compute chiplet), fabricated using TSMC’s N5 HPC finFET process.
Micron Y5BP D1β 12 Gb LPDDR5X DRAM Memory Floorplan Analysis
Analysis of the floorplan design used in the Micron Technology MT62F1536M64D8ZA-023 (Y5BP Die) D1β 12 Gb LPDDR5X and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets.
Global TWS & Banded Headset 88 Country Forecasts to 2029
Bluetooth headsets have become must-have products for many smartphone owners as vendors remove the 3.5 mm plug from their smartphones. China is the biggest market for True Wireless Stereo (TWS) and banded headsets, followed by the United Sates and India. Africa has emerged as one of the fastest-growing regions.
Telecom Operators Pioneering Use Cases for Generative AI
The following report by TechInsights on Telecom Operators Pioneering Use Cases for Generative AI brings a fresh, analytical perspective on the state of the telecom market and how vendors are adjusting to an influx of competition amid new smartphone features made possible with Generative AI. Everyday functions for departments found in every business are set to become automated with the help of Large Language Models.
Baidu Kunlun I SoC Digital Floorplan Analysis
Baidu and Samsung Electronics announced Baidu’s first cloud-to-edge AI accelerator, the Kunlun I chip. The Kunlun I accelerator covers diverse applications such as AI and HPC, manufactured using Samsung’s 14nm process technology.
Intel Core Meteor Lake Chiplet Package Advanced Packaging Essentials
The Core Ultra 7 155H is a desktop processor leveraging a disaggregated chiplet design strategy and Intel’s Foveros advanced packaging technology. The package incorporates four active chiplets (tiles) mounted to a passive interposer (base tile) using micro-bump interconnect.
Google Pixel 8 Tensor G3 SoC Digital Floorplan Analysis
The Google Tensor G3 is a package-on-package (PoP) assembly comprises a Micron LPDDR5 memory and the ZCF SoC. The Tensor G3 PoP was extracted from the Google Pixel 8 Pro smartphone.
Survey Plus Teardown of the Samsung Galaxy A55 5G SM-A556B/DS Smartphone
The Samsung Galaxy A55 5G is a mid-range device from the Galaxy A series of smartphones. It has a 120Hz, 6.6" Super AMOLED display with a resolution of 1080 x 2340 pixels. The smartphone also features a 32 MP front camera, and three rear cameras (50 MP, 12 MP, and 5 MP).
EV Developments at the Beijing Auto Show 2024
This report summarizes China’s largest automotive event, the Beijing Auto Show 2024. It compiles the most interesting premieres, technological revelations, and the latest announced development strategies of electric and hybrid vehicle manufacturers.
