Latest Blogs and Commentary
Unlocking the Secrets of Samsung's Galaxy A54 Mobile RF Architecture
A Comprehensive Analysis and Exploration of Key Components
Realtek RTL8720CM Winbond 35 nm 4Mb ePSRAM Memory Floorplan Analysis
This report (MFR) provides an analysis of the floorplan design used in the Realtek Wi-Fi&BT SoC RTL8720CM 4Mb ePSRAM manufactured in Windbond's Winbond 35 nm process technology and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets.
Autonomous Vehicle Carmaker Announcements
This database covers all the major carmaker announcements in regards to autonomous vehicles, both for semi and fully autonomous technologies.
From Tactile to Touch: The Interaction Continuum
Achieving a compelling in-cabin user experience is based on applying a mix or user interfaces within the vehicle.
Q2’ 2023: Samsung: Improved Profitability Despite Shipment Fall
Samsung shipped 53.5 million smartphones worldwide in Q2 2023, down -14% YoY, blaming to the mixed market demand brought by the global economic slowdown.
SunLune Technology Jasmier X4 Ethereum Miner ASIC XMC 40nm CMOS Process Digital Floorplan Analysis
This report provides an analysis of the floorplan design used in the SunLune Technology Jasmier X4 Ethereum Miner ASIC, fabricated on the XMC 40nm CMOS process, which incorporates DRAM DBI interconnect and includes an executive summary and supporting image sets SEM cross sectional and bevel imaging sets.
MediaTek MT6985W Dimensity 9200 Processor Package-On-Package with Integrated Organic Interposer Advanced Packaging Quick Look Analysis
This quick look report provides insight on the advanced packaging innovations used in the manufacturing of the MediaTek MT6985W Dimensity 9200 Processor, using PoP package with an organic interposer.
SEMICON West Highlights
SEMICON West Highlights G. Dan Hutcheson The Chip Insider® Summary: SEMICON West Highlights: Downturn Shock: Zombie-land facial expressions were characteristic of this year’s show. Back in December, few believed us when TechInsights analysts
IoT Connectivity’s Role in Sustainability
The recent extreme climate events worldwide have increased the focus on the importance of environmental sustainability.
Deep Dive Teardown of the HTC Vive Elite XR 2QBB100 VR Headset
The HTC Vive Elite XR is HTC’s latest VR Headset which doesn’t require a base station. This model features five cameras instead of six as in the HTC Vive Cosmos.
Deep Dive Teardown of the Harman GMC Sierra Head Unit INFO3.7-3.8 CSM Automotive
The GMC Sierra is a full-size pickup truck manufactured by GMC (General Motors Truck Company). The Harman INFO 3.7-3.8 CSM is an infotainment system developed by Harman, a global technology company specializing also in automotive solutions.
i.MX91 Targets Simple Edge Systems
NXP’s i.MX91 addresses simple edge applications with a feature subset of the i.MX93, maintaining pin compatibility and reducing power.
Cortex-X3 Proves Its Area Efficiency
TechInsights’ floorplan analyses of smartphone processors reveal the size of CPUs and caches.
NVIDIA H100 Hopper TSMC CoWoS-S Flip Chip Ball Grid Array
This report provides a deeper insight on the advanced packaging innovations used in the manufacturing of the nVIDIA Hopper GH100 GPU.
Dimensity 6100+ Lags at Low End
Qualcomm’s Snapdragon 4 Gen 2 offers more-powerful CPUs and faster DRAM than MediaTek’s Dimensity 6100+, but neither new chip delivers much improvement to low-cost smartphones.
Lead-Sheathed Cable Risks Greatly Exaggerated
An investigative report in the Wall Street Journal claims that lead-sheathed cable in US telecom outside plant represents a public health and environmental hazard.
Preliminary Global Notebook PC Shipments and Market Share: Q2 2023 Results
Notebook PC shipments declined -13% in the second quarter of 2023 versus the same period a year ago and totaled 47.4 million.
GaN and Microwave Acoustics Take Center Stage at IMS 2023
GaN and Microwave Acoustics Take Center Stage at IMS 2023 Share This Post Advances in GaN devices for the millimeter wave took center stage at IMS 2023 with new products and R&D results from BAE, HRL, Intel, NGC Qorvo, Wolfspeed, and others. Acoustic
