Latest Blogs and Commentary
Samsung’s 3nm GAA Process in Whatsminer ASIC - Disruptive Event
TechInsights has identified Samsung's revolutionary 3nm Gate-All-Around (GAA) process within the Whatsminer M56S++ crypto-mining ASIC from Chinese manufacturer MicroBT.
Deep Dive Teardown of the Apple Mac Mini A2816 Personal Computer
The Mac Mini A2816 runs the M2 Pro/APL1113 64-bit dodeca-core applications processor, manufactured by TSMC for Apple.
Deep Dive Teardown of the Fibocom FM350-GL Wireless Module
The FibocomFM350-GL module is a 5G wireless communication module released for the global market, supporting 5G standalone network (SA) and non-standalone network (NSA) network architectures.
A Brief History of Insulated Gate Bipolar Transistors (IGBTs) with Curated TechInsights Analysis
Two groundbreaking advancements have shaped the landscape of IGBT development, including the advantages of trench and field stop technology, also known as soft punch-through.
The Vivo V2 Brings More High-Speed Interfaces, Better Image Processing Capabilities
Image Sensor subject matter expert Jefferson Chua discusses what makes this ISP impressive in his blog.
Sony, Onsemi, and Samsung Showcase Revolutionary Automotive Image Sensors at IISW 2023
At the IISW 2023 Sony, onsemi, and Samsung each presented research on upcoming devices designed specifically for the automotive industry.
Presenter - Automotive Electronics System Demand - July 2023
This market forecast highlights the impact that vehicle architecture change is having on automotive electronics system demand.
Appendices - Automotive Electronics System Demand - July 2023
This market forecast highlights the impact that vehicle architecture change is having on automotive electronics system demand.
Main Data Tables - Automotive Electronics System Demand - July 2023
This market forecast highlights the impact that vehicle architecture change is having on automotive electronics system demand.
Tablet Cellular Connectivity and eSIM Shipment and Installed Base Forecast by Form Factor 2010-2028
Wi-Fi does not always provide the ideal connectivity solution for mobile computing on the go.
SpecTek PT040-56B DDR5 DRAM (Micron 1α) Memory Floorplan Analysis
This report (MFR) provides an analysis of the floorplan design used in the SpecTek PT040-56B DDR5 DRAM (Micron 1α) and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets.
Meta AI Chip Targeted Recommenders
Meta has developed an AI accelerator chip called MTIA, following in the footsteps of Google and Amazon. Employing RISC V CPUs and fixed-function units, the chip offered 102 INT8 TOPS at 25 W TDP.
Lightelligence Connects Chiplets
Lightelligence’s ONoc interposer connects chiplets optically through silicon waveguides on a monolithic multireticle substrate. The company launched a machine-learning application as a demonstrator.
MLPerf Benchmarks GPT Training Times
The MLPerf benchmark added tests to assess GPT-training performance. AI processors from Nvidia and Intel (Habana) both exhibit good scaling.
Deep Dive Teardown of the Harman 4D DSS Booster ALEV4-02 Automotive
The Harman 4D DSS Booster is a part of Bowers & Wilkins 4D Diamond Surround Sound used in BWM iX vehicles.
STMicroelectronics VB56G4A 1.5 MP Resolution 2.61 μm Pixel Pitch Stacked Back-Illuminated Monochrome CMOS Image Sensor Device Essentials
This report presents a device essentials (DEF) of the STMicroelectronics VB56G4A 1.5 MP resolution, 2.61 μm pixel pitch, stacked back-illuminated monochrome CMOS image sensor for automotive applications.
Deep Dive Teardown of the Samsung A34 5G SM-A346E/DSN Smartphone
Compared to Samsung's A32 5G and A42 5G, the A34 5G has an entirely different RF design even though some ICs are the same.
Taiyo Yuden FSFCSR1T2G44EG66 Film Bulk Acoustic Wave Resonator (FBAR) Filter Process Analysis
This report presents a process analysis (AFF) of the Taiyo Yuden FSFCSR1T2G44EG66 Film Bulk Acoustic Wave Resonator (FBAR) Filter, extracted from the Honor 70 5G smartphone.
