Latest Blogs and Commentary
Apple A-Series and M-Series Apps Processor Tracker Q3 2023: iPhone 15 Series Provides Seasonal Boost to Chip Output
Apple's A-series and M-series applications processors (AP) revenue increased 7 percent year-on-year in Q3 2023 due to favorable mix shift towards premium chips.
Chip Observer (January 2024)
TechInsights' Chip Observer, a publication dedicated to monitoring the semiconductor market from production facilities to consumer endpoints.
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Automotive Infotainment & Telematics - Semiconductors Q1 2024 Spreadsheet
TechInsights’ Automotive Infotainment & Telematics Q1 2024 Semiconductor Market Report provides a forecast outlook for OEM and aftermarket hardware and applications market from 2020 through 2030. The OEM market opportunity for Infotainment & Telematics chipset vendors increased by 13.8% YoY in revenue terms in 2023 on the back of strong vehicle production growth of over 10% YoY.
Automotive Infotainment & Telematics - Systems & Features Q1 2024 Spreadsheet
TechInsights’ Automotive Infotainment & Telematics Q1 2024 System Market Report provides a forecast outlook for the OEM and Aftermarket hardware and feature market from 2020 through 2030.
Automotive Infotainment & Telematics - Vendor Market Shares & OEM Features Q1 2024 - Spreadsheet
TechInsights’ Automotive Infotainment & Telematics System and Semiconductor Market Report provides a forecast outlook for the OEM and Aftermarket with detailed feature forecasts as well as vendor market shares for the main suppliers of systems and application specific semiconductors.
Semiconductor Sales were up 17% YoY the Week ending Jan 19, 2024
TechInsights' Semiconductor Analytics Report: Semiconductor sales rocketed 20% last week and were up 17% from this time last year. Zooming in on NAND IC, the 13-week MA increased to 20% YoY growth last week. TechInsights forecasts NAND IC sales will result with a 29% YoY decline to $39 billion in 2023.
TechInsights for Product Manufacturer - Mobile Devices
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Consumer Electronics Video Series Part 4: Post-Show Reflections
Consumer Electronics Video Series Part 4: Post-Show Reflections Unpacking CES® 2024 Join TechInsights Director of Consumer Electronics Research, David Watkins, and the leading analysts who attended CES® 2024, as they reflect on the accuracy of their
TechInsights for Product Manufacturer-Telecom & Network
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TechInsights for Product Manufacturer-Consumer Electronics
TechInsights Consumer Electronics Leverage unrivaled technical insights about the continuous cycle of innovation in the semiconductor market to benchmark chip design against competitors. Platform Member? Sign In Start your free trial Your Consumer
CES 2024 – Wearable and XR Highlights
CES 2024 brought some 130K visitors and more than 4,000 exhibitors to Las Vegas, being the world’s largest audited in-person tech event. “AI for All” was the main theme of the show this year, with on-device AI or AI on the (network) edge being a specific focus area especially for chip vendors and mobile device manufacturers. In this report, we focus mainly on the wearable devices and XR headsets and applications showcased at the event.
Deep Dive Teardown of the Amazon Echo Show 5 H97N6S Smart Display
The third generation from 2023 -Amazon Echo Show 5 H97N6S, just like its first version from 2019 - Amazon Echo Show 5 H23K37 provides smart display solutions suitable for home and office applications. Both devices were equipped with 5.5-inc TFT-LCD Display with Touchscreen of 960x480 pixels resolution with capacitive touchscreen.
Deep Dive Teardown of the Bosch Multi Purpose Camera 3 L8B2-14F404 Automotive Camera
Several manufacturers share design wins in the Bosch Multi-Purpose Camera 3 Camera. Renesas' R-Car V3H SoC, supported by a 32-bit microcontroller powers the core processing. RAM memory was provided by Samsung.
Broadcom BCM67263 Wi-Fi 7 Access Point SoC Floorplan Analysis (IoTB)
This is a Basic Floorplan Analysis (BFR) of the Broadcom BCM6717 RF transceiver die found inside Broadcom BCM67263 and BCM6726 components. Both Broadcom BCM67263 and BCM6726 components are 4x4 IEEE 802.11be Wi-Fi 7 MAC/PHY/radio system-on-a-chip (SoC) devices with Multi-Link Operation (MLO) in addition to multi-user technologies such as OFDMA (downlink and uplink) and MU-MIMO (downlink and uplink).
Unknown Manufacturer S111341A High-band/Mid-band Front End Module Packaging Analysis (RFPK)
The S111341A high-band/mid-band front end module was found in Huawei's Mate 60 Pro mobile handset, which also features SMIC’s first 7nm device. The module contains eight active dies and 65 other passive devices.
TechInsights for Mobile Carriers
TechInsights Mobile Carriers covers various aspects such as network infrastructure, emerging technologies, spectrum management, and business strategies of mobile carriers.
TechInsights for Product Manufacturer-Connected Computing
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