Latest Blogs and Commentary
Survey Plus Teardown of the Xiaomi Redmi 13C 23106RN0DA Smartphone
Compared to the Redmi 12C, the Redmi 13C comes with a new design. It has a boxy design with a slightly broad form factor to offer a bigger canvas to people for viewing content. There is no prominent camera module at the back and the sensors are directly incorporated, making the rear panel look neat.
The Chip Insider®– Hi-NA EUV, Intel-UMC Partnership, Taiwan’s elections
This blog offers valuable insights into recent developments in the ever-changing landscape of technology and geopolitics, answering pressing questions about Hi-NA EUV, the Intel-UMC Partnership, and Taiwan's elections.
Bernadette Finn
Bernadette joined Teligen in March 1993 and now heads up our tariff research operation. In her career here she has developed an in-depth knowledge of national and international telecom tariffs for a wide range of fixed and mobile services.
Adrienne Downey
Adrienne Downey is a Market Research Analyst with over 25 years of industry experience. Throughout her career, Adrienne has covered a variety of semiconductor disciplines spanning memory, end markets, and manufacturing.
Jim Feldhan
As a Consultant with TechInsights, Jim Feldhan has over 43 years of industry experience. Jim has been deeply involved in the semiconductor information and analysis business for decades and has built several models used to forecast and identify changes in the semiconductor industry.
Ed Korczynski
Ed Korczynski is a Technical Product Manager at TechInsights with over 40 years of industry experience. Over the course of his career, Ed has been involved with semiconductor fabrication from diffusion to final-test, process R&D, equipment applications and services, critical sub-systems, and specialty materials.
Memory Market Heats Up as Analog is Cooling
Order activity for semiconductor equipment held. Memory continues to lead in the recovery. There were very minor changes made to our forecasts this month. This report provides key performance indicators across the semiconductor and equipment manufacturing supply chain.
Peter Chippendale
As an Industry Analyst, Peter Chippendale has over 5 years of engineering experience, with 2 years of experience specializing in the automotive sector. At TechInsights, Peter focuses on forecasting semiconductor usage in the Electric Vehicle sector and charging networks.
NXP, TI Distribute Auto Radar
NXP and TI have updated their automotive radar SoCs with new versions intended for centralized processing of radar data.
Samuel Siegel
As an Associate Market Research Analyst at TechInsights, Samuel Siegel has over 3 years of experience in data analysis. Samuel is an inquisitive analyst with a passion for digging into the data.
GigaDevice GDP1BFLM-CB CXMT G3 2Gb DDR3L SDRAM Transistor Characterization
This report presents Key DC characteristics for NMOS and PMOS transistors located in the word line drivers and sense amplifiers regions of the GigaDeviceHUANGSHAN4G die found inside the GDP1BFLM DDR3L SDRAM component extracted from a MiliankeMLK-CA03FPGA development board.
Unveiling the Amazon Echo Show 5
Introducing the Amazon Echo Show 5 H97N6S – the pinnacle of smart displays. With a 5.5-inch touchscreen, powerful hexa-core processing, and the new Vega OS, it promises a seamless user experience. Enhanced with a 2 MP front camera, upgraded speaker, and compatibility with WiFi 5, Bluetooth, and Matter protocol.
eSIM/iSIM Smartphone Sales Forecast by Region to 2028
Global eSIM and iSIM smartphone sales volumes will grow by double-digit percentages YoY in 2023. Propelled by North America today and by India and eventually China in later years, eSIM/iSIM-enabled smartphones will reduce friction for smartphone customers looking to enable their devices.
Pressure Points and Limitations Faced by Huawei
Pressure Points and Limitations Faced by Huawei Mate 60 Pro Mobile RF Report Part II In this Part II, we're continuing the analysis of the RF FE and its key RFIC and modules that began with " Mate 60 Pro mobile RF architecture proves Huawei can
CES 2024: Trends in Immersive Automotive User Experience
Immersion and emotional connections with users were a key theme at CES 2024, with Mercedes showing their updates for both MB.UX and announcing MB.OS as well as the Sony Honda Afeela which creates an interior connected to entertainment—be it music, spoken word audio, or games—via artwork, lights, sound, and haptic feedback with the aim to increase emotional attachment.
让我们来看看IC市场动态、TechInsights逆向工程团队正在分析哪些器件？
半导体市场规模预计将在未来十年翻一番 让我们来看看IC市场动态、TechInsights逆向工程团队正在分析哪些器件？以及未来器件技术路线图。 创建账户 申请试用 你知道吗? 苹果iPhone 15 Pro的IC芯片仅一个季度就能产生超过11.3万吨的碳排放 IC元器件无处不在，从电动牙刷到汽车，它们的综合碳影响可能是惊人的。 TechInsights BOM数据库碳排放模块为来自半导体晶圆厂、无晶圆厂IC制造商、设备OEM、生命周期分析师及其客户的用户提供关键的IC芯片碳排放计算，以快速比较
반도체 제조사나 공급망 관련 회사에서 근무하시나요?
반도체 시장은 향후 10년간 두배로 성장 할 것으로 예상됩니다 IDM 혹은 공급망 기업에서 근무중 이신가요? IC 시장의 현재와 미래, 그리고 디바이스 기술 로드맵을 확인해보세요. 테크인사이츠의 리버스엔지니어링 팀은 어떤 디바이스를 분석할까요? 계정 만들기 Demo 요청하기 알고 계셨나요? 애플의 아이폰 15 Pro는 단 한 분기만에 IC 다이에서 113,000톤 이상의 탄소 배출량을 생성할 수 있습니다. IC 부품은 전동칫솔부터 자동차까지
IDM またはそのサプライ チェーンで働いていますか?
半導体市場は今後10年間で倍増すると予測 半導体メーカー、あるいはそのサプライチェーンに従事されいますか? 現在および今後のIC市場について、テックインサイツのリバースエンジニアリングチームが現在分析しているデバイス、及び今後のデバイス技術ロードマップをご確認下さい。 アカウントを作成する デモをリクエストする ご存じですか？ Apple iPhone 15 Proは、わずか1四半期でICダイから113,000メトリックトン以上の二酸化炭素を排出します IC部品は
