Latest Blogs and Commentary
Embedded WLAN (Wi-Fi) CE Device Global Market Analysis
This report complements and discusses the recently published Global Wi-Fi report focusing on various CE Device products including Smartphones, Mobile PCs and Tablets, Smart TVs, Game Consoles, Digital Media Streamers, Wireless Speakers, and more.
Western European Connected TV Market Q3 2023
While the growth of advanced display TVs remains a long-term trend, the current cost-of-living crisis, particularly acute in Western Europe, is limiting its development in Q3 2023, as brands compete on the cheaper end of the market. This report examines the impact of these and other factors on connected TV devices and the TV OS market in Western Europe.
AI Chips Top Processor Growth
TechInsights has forecast a doubling of semiconductor sales over the next decade. Some of the dynamics playing out in processors and memory may impact that forecast.
Intel Fractures 14th Generation Mobile
Intel’s Meteor Lake processor has yielded 11 laptop models. They feature fewer threads than prior families but include a new lower-power efficiency core.
Data-Center AI Chips Charm Wall Street
The year 2023 saw the data-center AI chip market reach a new height—Nvidia attained a trillion-dollar valuation. Other vendors, including hyperscalers, marched forward with the next version of their chips.
Toshiba TH58LKT2V46BA8S 162L 512Gb TLC 3D NAND Memory Floorplan Analysis
This is a Memory Floorplan Analysis (MFR) of the DapuStor FXZ5_512G die found inside the Toshiba TH58LKT2V46BA8S. The TH58LKT2V46BA8S was extracted from the DapuStor HaiShen5 3.2 TB H5300 SSD.
Analysis: Smartphone Image Sensor Market Forecast 2024–2029
The global market for smartphone image sensors (CIS) is projected to surpass US$ 20 billion in revenues by CY2029, experiencing growth at a CAGR exceeding 5% in five years. This report provides an analysis of the market data report “Smartphone Image Sensor Market Forecast 2024–2029: Recovery in CIS Demand to Steer Revenue Growth”.
NXP SN200 (200VB111) GlobalFoundries 40nm 2Mb eFlash Process Flow Analysis
This report provides an analysis of the process flow and integration used in the manufacture of the NXP SN200 (200VB111) NFC, built in GlobalFoundries 40nm eFlash process technology. The spreadsheet lists the hundreds of process flow steps required in its manufacture.
Mark Fitzgerald
In his role as Autonomous Vehicle Channel Director at TechInsights, Mark Fitzgerald tracks the relationships between automotive semiconductor vendors, Tier 1 suppliers, and automakers to the availability of safer vehicles through advanced driver assistance systems (ADAS) and autonomous vehicle solutions.
Automotive Semiconductor Supplier and OEM Relationships
Matrix of relationships between Automotive OEMs and semiconductor suppliers based on our research. Covers 16 OEMs and 14 semiconductor suppliers with details on type of relationship if known.
Issues Impacting the Semiconductor Industry
Qualitative information about issues that may impact the semiconductor industry / supply chain. Includes macro events, geopolitical, materials, etc.
GaN’s Role in Transforming the Power Electronics Landscape
Although at the early stage of market development, GaN is set to take the traditional Si-based power device market by storm over the medium-to-long term, beginning with the low-to-medium voltage application segment.
Order Activity is Edging Higher as Memory Pricing Recovers
Semiconductor equipment order activity increased to a moderate 70 °F last week as the weakness in Subcons and DAO was offset by the strength in memory and mobile.
Semiconductor Sales were up 17% YoY the Week ending Jan 12, 2024
TechInsights' Semiconductor Analytics Report: Semiconductor sales jumped 11% last week and were up 17% from this time last year. Zooming in on DRAM IC, the 13-week MA moved to 31% YoY growth last week. TechInsights forecasts DRAM IC sales will result with a 38% YoY decline to $52 billion in 2023.
Google Tensor G3 System-on-Chip Samsung Fanout Panel Level Packaging Advanced Packaging Quick Look
The Tensor G3 chipset powers Google’s top of the line mobile handsets, the Pixel 8 family. Manufactured in a package-on-package (PoP) configuration, the Tensor G3 bottom package is paired with a Micron LPDDR5 top package.
Brian Matas
For over 25 years, Brian Matas has been providing clients with a thorough understanding of market trends/sales, capital spending, foundry, and the potential impact on systems growth.
Andreas Koehler
As the Director of Connected Home Devices at TechInsights, Andreas Koehler has over 30 years of experience across the automotive, consumer electronics, wireless, and IoT industries.
Edouard Bouffenie
Edouard Bouffenie is a Senior Analyst in the Media and Intelligent Home practice at TechInsights, with over 20 years of experience in market analysis.
