Latest Blogs and Commentary
Tracker: Global Wearables Vendor Market Share: 2024 Q1
The race for the top wearables spot continues as Apple, Huawei, and Samsung battle it out. Global wearables shipments stabilized in Q1 2024, though still declined slightly, marking the sixth consecutive quarter of declines amid continued macroeconomic weakness and geopolitical uncertainty, causing a lengthening replacement cycle and limiting consumer spending.
Slower EV Sales Growth: But xEV Semiconductors Still Growing
Electric vehicle sales see continued growth, but not at the rate they have seen during 2023. The media has published articles that, in some cases, incorrectly show a decline in sales. This was among the topics discussed and presented at the Vehicle Electrification Expo (and adjacent Battery Cell Expo) at the National Exhibition Centre in Birmingham, UK, on May 15th-16th.
Huawei Pura 70 Ultra HBP-AL00 Smartphone Quickturn Teardown
Chiplets, which break down large, integrated system-on-chips (SoCs) into smaller functional blocks, are positioned to revolutionize the semiconductor industry. By allowing different companies to design and optimize these smaller blocks, the chiplet approach enables more innovative and efficient designs.
Report Overview: Chiplet Market Introduction: Computing
Chiplets, which break down large, integrated system-on-chips (SoCs) into smaller functional blocks, are positioned to revolutionize the semiconductor industry. By allowing different companies to design and optimize these smaller blocks, the chiplet approach enables more innovative and efficient designs.
Research Bulletin – US Department of Commerce Puts $285 Million of CHIPS Act Funds Toward Digital Twins for Semiconductor Manufacturing
Earlier this month, the Department of Commerce announced plans to allocate $285 million toward the creation and operation of “a CHIPS Manufacturing USA institute focused on digital twins for the semiconductor industry,” promoting the development and sharing of digital twin technology to aid in semiconductor design, manufacturing, packaging, and testing.
Fujitsu MB85AS12MTPW-EAERE1 40 nm 12 Mb ReRAM Memory Floorplan Analysis
The Fujitsu MB85AS12MT 12 Mb ReRAM die extracted from the MB85AS12MTPW-EAERE1 package. This Memory Floorplan Analysis Report (MFR) provides an analysis of the floorplan design used, the process node and foundry identification on the 40 nm process found in the MB85AS12MT 12 Mb ReRAM die.
OmniVision OV50H Advanced Floorplan Analysis
An advanced floorplan analysis of the image signal processor (ISP) die from the OmniVision OV50H ISP, 1/1.3”, 50 MP, 1.2 µm Pixel Pitch Stacked Back-Illuminated PureCel®Plus-S CMOS Image Sensor with Quad Phase Detection (QPD) Autofocus Technology was extracted from the Xiaomi 14 Pro rear camera.
Insight: Q1 2024 Notebook PC Results – PC Market Continued Path to Recovery, Grew 7%
Notebook PC shipments grew 7% in the first quarter of 2024 versus the same period a year ago and totaled 46.1 million units. This is the second quarter the PC market has grown after falling for eight consecutive quarters.
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2024 Beijing Auto Show: Key Themes
The 2024 Beijing Auto Show was held between April 25 and May 4th, 2024. The 10-day event attracted more than 1,500 exhibitors including OEMs, automotive suppliers, and automotive technology companies. Centralized computing platforms, generative AI, and international business expansion were key trends at the show.
Canon 3.2 MP Stacked SPAD Image Sensor Device Essentials Folder
The Canon LBC010 features 3.2 MP resolution, 6.39 μm pixel pitch*, stacked, back-illuminated (BI) direct-time of flight (d-ToF) single photon avalanche diode (SPAD) LiDAR sensor extracted from Canon MS-500 camera. This Canon LBC010 is introduced by an ultra-small SPAD sensor capable of capturing the world's highest resolution of 3.2 MP with high sensitivity in low-light environments.
Insight: Matter 1.3 Delivers a Boost for Smart Home Interoperability
The importance of supporting the Matter ecosystem for consumer electronics component suppliers continues to grow with the Connectivity Standards Alliance (CSA) releasing version 1.3 of the Matter standard and software development kit (SDK) on May 8, 2024. Despite the slow rollout of Matter enabled products by manufacturers so far, the addressable market for Matter-enablement continues to expand.
Tracker: USA: Smartphone Shipments & Marketshare by Model: Q1 2024
The United States is the world's most influential smartphone market. It delivers high volume and revenue to device makers, component suppliers and operators. Our extensive report shows the top-50 best-selling smartphone models in the United States in the first quarter of 2024. Besides popular Apple and Samsung flagships, which brands and models have made their way into the bestsellers and what is the secret behind their success?
Denso BCD-on-SOI Toyota Prius Battery Control Module (2023) PMIC Essentials
Analyzing the Denso SV061 power management integrated circuit (PMIC) from the Toyota Prius Mk5 battery control unit (BCU), it reveals collaborative efforts between Denso and Toyota to advance hybrid technology.
Report Overview: 5G mmWave Enters the Global Mainstream
mmWave 5G bands have encountered some growing pains on a global scale since initial launch due to a litany of factors. However, recent market trends have indicated that future deployments are likely to gain traction in countries outside the United States and Japan.
Insight: UHD TV Forecast Q1 2024 - Samsung Focuses on Upscaling in Absence of Native 8K Content
While large screen TVs are all the rage, 8K is not, with 409K units shipping globally in 2023. While global 8K shipments will continue to grow year-over-year it is not until the end of the decade that we will start to see an adequate number of 8K TVs shipping (20.7 million in 2029) that they will begin building a sufficient installed base to be relevant in the marketplace. This Insight examines what TV brands, like Samsung, are doing to help boost 8K TV sales.
Memory Pricing Report – May 2024
This monthly update delves into the dynamic and volatile pricing landscape of mainstream DRAM and NAND memory, offering an examination of pricing trends over the past three months and projecting developments for the upcoming year.
Infineon BTS7008 Automotive Smart High-Side Power Switch PMIC Essentials
Within the (PROtected FET) PROFETTM+2 12 V family, Infineon's BTS7008-2EPA is examined alongside the utilization of Infineon’s SMART7 high-side switches technology.
