Latest Blogs and Commentary
Brazil xEV System, Semiconductor and Sensor Demand Forecast 2022 to 2031 - May 2024
This TechInsights data model presents a view of the Brazil outlook for xEV systems and associated semiconductor and sensor demand. The market remains at an early stage with a primary emphasis towards hybrid platforms. Deployment of battery electric vehicles remains at an early stage with combined volumes still expected to be lower than for hybrid platforms.
OECD Mobile Broadband Price Benchmarking Q1 2024
The Q1 2024 update of the OECD Mobile Broadband Price Benchmarking service is now available for download and includes over 1,100 mobile broadband tariff plans from more than 100 providers across 38 OECD countries. The OECD Mobile Broadband Price Benchmarking Service uses the OECD 2017 baskets. There is no distinction between device types, so all baskets can be used with any device. Historical pricing for the OECD countries over several years is also available.
USA Smartphone Vendor Marketshare by Operator: Q1 2024
Smartphone shipments in the United States were down year-on-year in Q1 2024. Apple was number one in hardware shipments and Samsung led in the Android space. Verizon was the market smartphone shipment leader. This report tracks smartphone shipments, vendor market share, and OS market share for the major brands and major OS platforms in the United States across 3 top operators and the total market on a quarterly basis from Q1 2011 to Q1 2024. Operators covered include Verizon Wireless, AT&T and T-Mobile.
USA Handset Vendor Marketshare by Operator: Q1 2024
Handset shipments in the United States declined year-on-year in Q1 2024. Apple led across major carriers, followed by Samsung, which led Android, and then by Motorola, and TCL-Alcatel. Verizon Wireless was the standout operator. This extensive report tracks mobile handset shipments and vendor market share for major vendors at the "Big 3" operators in the United States on a quarterly basis from Q1 2009 to Q1 2024.
Apple iPhone Shipments by Model: Q2 2007 to Q1 2024
Apple global iPhone shipment decreased 11% annually during Q1 2024, underperforming overmarket which went up 10% YoY. iPhone 15 Pro Max topped the chart this quarter, followed by iPhone 15 Pro and 15. iPhone 14 Pro Max and iPhone 15 Plus ranked the top 5 list too. This report details global shipments for every iPhone model since its launch through Q1 2024, from the iPhone 2G to the iPhone 15.
Telecoms Operators Pioneering Use Cases for Generative AI
Internally operators have already begun to leverage Gen. AI to automate not only administrative tasks, but also new use cases for network optimization and problem resolution with ‘domain specific’ LLMs (Large Language Model) for their own use. And externally, Gen AI. Use cases for customer self-care, enhanced service operations and secure access authentication are already reducing telecoms operating costs.
Deep Dive Teardown of the HP Spectre X360 16-F2097NR Laptop
HP continues its design tradition of using an aluminum enclosure fitted to all internal components. Samsung provides a 16-inch 3840x2400 pixel OLED Display with a multitouch Touchscreen. The brightness of that display is 400 nits. Dimension is 351.80 x 233.4 mm with a weight of 334.4 grams. The stylus is charged by USB Type-C. The total weight is 14.5g. The stylus is a part of the laptop and is included in the box.
Ultra High Definition TV Displays: Global Market Forecast
This report forecasts global demand for Ultra High Definition 4K and 8K TVs across 6 regions and 88 countries from 2014 to 2029. The report provides historical and forecast data for total Ultra High Definition TVs split by 4K and 8K.
Public Cloud Demand Forecast Q2 2024: CPUs, Accelerators, and Memory
This workbook provides a forecast on public cloud demand in terms of hours of consumption. It also translates hourly consumption into the equivalent number of processors and accelerators sold by cloud providers, and the minimum shipments required by cloud providers to sustain demand.
Intel Core Meteor Lake (Intel4) I/O Die Digital Floorplan Analysis
Intel Core Meteor Lake (Intel4) I/O Die Digital Floorplan Analysis Share This Post The SRMZ1 is a 3D packaging assembly comprising a side-by-side arrangement of four dies, including an input/output (I/O) die with die makings 8PNVC, mounted on a
TSMC Gate Architecture Evolution 2024
This report is based on the reverse engineering results developed by TechInsights and coupled with the knowledge and expertise of TechInsights’ subject matter experts. It includes publicly available information and discussed to help better understand the process and focuses only on devices fabricated by TSMC.
TSMC 28 nm eFlash (Renesas RH850/U2A8) Process Flow Analysis
Analysis of the process flow and integration used in the manufacture of the Renesas automotive microcontroller R7F702301BEBBA-C_BC6 comprising a Renesas R7F702301B die, built in TSMC 28 nm embedded flash memory technology. The spreadsheet lists the hundreds of process flow steps required in its manufacture.
GPU Cloud Providers Step-Up Where the Hyperscalers Fall Down
The surge in enterprise cloud adoption and the growing demand for GPU-accelerated computing has presented a golden opportunity for smaller, GPU-focused cloud providers. The goal of these so-called GPU Cloud providers isn’t to replace cloud hyperscalers; instead, they aim to complement them within enterprises’ multi-cloud strategies.
How could SMIC achieve 5 nm?
This is a short summary highlighting the path that SMIC might take to achieve 5 nm technology.
Deep Dive Teardown of the Iridium Satellite LLC 9603N Satellite Module
The Iridium Satellite LLC 9603N is an IoT Module that supports two-way satellite communication connectivity. The Iridium 9603 delivers Iridium Short Burst Data in an extremely small form factor. Iridium Short Burst Data (SBD) - simple, efficient packet-based service for frequent short data transmissions between equipment and centralized host computer systems.
Ryzen PRO 8000 Nudges Enterprises Toward AI PC
AMD’s latest series of processors for the enterprise market, the Ryzen PRO 8000 series, offers an upgraded AI engine that improves AI acceleration for businesses and professional users.
Arm Updates Automotive Offering
Arm has bolstered its automotive offering with CPUs, an image-signal processor, and multicore cluster infrastructure blocks. Configuration options enable ASIL B or ASIL D safety.
TechInsights’ Storage Team Takes You Inside the Huawei Pura 70 Ultra Smartphone
TechInsights' teardown of the Huawei Pura 70 Ultra reveals the intricate details of this cutting-edge smartphone. Powered by the Kirin 9010 chipset, this device boasts impressive performance capabilities. Our analysis delves deep into the Kirin 9010, assessing its fabrication process and comparing its efficiency and performance to previous models.
