Featured Report Analysis
Samsung Exynos 2600 (2nm SF2) Transistor Characterization
TCR details NMOS and PMOS characteristics on Samsung’s 2 nm SF2 GAA die, profiling key electrical metrics for high‑performance core transistors.
Baidu Kunlunxin P800 AI Accelerator Processor Floorplan Analysis
Digital floorplan analysis examines Baidu Kunlunxin P800 AI accelerator die, highlighting 345 FP16 TFLOPS performance and advanced design.
Intel Panther Lake 18A (16th Gen Ultra X7 358H) Transistor Characterization
TCR details NMOS and PMOS transistor characteristics on Intel 18A compute die, featuring RibbonFET GAA and PowerVia backside power delivery.
200mm Watch
First 2026 update of the 200mm Watch provides the latest view on 200mm semiconductor trends and activity.
Baidu Kunlunxin P800 AI Accelerator Interconnect and Packaging Analysis
Reverse-engineering analysis of Baidu Kunlunxin P800 dives into the 2.5D packaging, interposer technology, substrate design, and more.
STMicroelectronics FX62A 28 nm FD-SOI ePCRAM Memory Process Flow Analysis
Process flow analysis of STMicroelectronics FX62A die, built on Samsung 28 nm FD-SOI with ePCM.
Free Access to Five Key Reports – Curated Each Month 🆓
March's five pieces of high-value analysis available to registered users for free.
Market Data: Industry Performance (TCI Graphics)
TechInsights latest insights on capital equipment, IC demand/supply, capacity, and end markets.
Company Earnings: SK hynix
Company Earnings: SK hynix 2 Min Read May 7, 2026 These reports provide key takeaways about SK hynix's demand and supply from their quarterly earnings call. This summary outlines the analysis* found on the TechInsights' Platform. Read The Analysis
Samsung Exynos 2600 Brings 2nm to Smartphones
Samsung’s Exynos 2600 marks a strategic shift, bringing the first 2nm smartphone SoC to market via vertical integration and new non‑monolithic die design.
Analysis: The $100 Billion Question: Can China Deliver Datacenter AI Performance Without NVIDIA?
Analysis examines whether expanded SMIC capacity and advanced packaging could enable China to offset export‑driven compute limits and compete in AI chips.
Silicon Wafer 300mm Drives Long-Term Growth
Silicon wafer markets are stabilizing as shipments rise, but pricing pressure limits growth, with revenue recovery led by expanding 300mm adoption.
Insight: Automotive Semiconductor Inventory Ratios Eased in Q4 2025, but Conditions Diverged by Device Family
Q4 2025 auto semiconductor inventories eased to 0.85 as memory tightened, logic fell below 1.0, while mature‑node categories remained elevated.
Semiconductor Analytics – April 30, 2026
Semiconductor sales rose both weekly and annually by April 24, 2026, with Analog & Power ICs posting a year‑on‑year increase.
Insight - Qualcomm Fiscal Q2 2026 Financial Results
Qualcomm’s Q1 2026 results highlight strong automotive growth toward a $5B run rate, new AI datacenter opportunities, and a mobile business nearing a bottom.
How AI is Driving Sensor Proliferation in Smart Home
Daily insight examines sensor growth in smart homes, driven by low‑power on‑device machine learning and AI adoption.
Narrative: Global Smartphone Revenues, ASPs and Price-Tier Forecasts: 2008 to 2031: April 2026
TechInsights expects smartphone wholesale revenue to rise 2.4% in 2026 as higher ASPs and premium mix offset volume declines.
2026 Beijing Auto Show: Chinese Lidars Moving to Higher Chip Integration and Resolutions
Hesai, Huawei, and RoboSense unveiled new lidar sensors with higher chip integration, boosting detection channels and resolution performance.