Featured Report Analysis
Summary - Samsung Galaxy S26 (SM-S942B) Deep Dive Teardown
Summary deep dive teardown of The Samsung Galaxy S26 Exynos 2600 includes detailed product disassembly analysis on unique construction, benchmarking, and cost data.
Analysis: In-Vehicle Technology Awareness and the Consumer Discovery Journey
Results of TechInsights survey of consumer awareness of core technologies in ADAS, OTA Updates, and software and AI features.
Huawei Pura X Max - Unboxing Video
Unboxing video of the Huawei Pura X Max, a foldable smartphone with LTPO OLED display, Kirin 9030 Pro processor and a triple-camera system.
Huawei Pura X Max - Teardown Video
Device teardown video of the Huawei Pura X Max, a foldable smartphone with LTPO OLED display, Kirin 9030 Pro processor and a triple-camera system.
Intel, Softbank Announce Z-Angle Memory to Compete with HBM
Intel and SoftBank unveil collaboration on Z-angle memory, a new memory technology aiming to get to commercialized by 2030.
2026 Beijing Auto Show: Pony.ai and WeRide Reinforce NVIDIA’s Dominance in L4 Autonomy
NVIDIA reinforces L4 autonomy dominance as Pony.ai and WeRide unveiled L4 autonomous-driving controllers at the 2026 Beijing Auto Show.
Skyworks SKY520-21 LMHB L-PAMiD Module Architecture Analysis
Module Architecture Analysis report of Skyworks SKY520-21 shows integration of LMHB RF for 4G/5G applications, highlighting front-end module consolidation trends.
AMD Pushes Ryzen AI Embedded P100 for Edge AI and Automotive Compute
AMD Ryzen AI Embedded P100 targets embedded and automotive systems with Zen 5 CPUs, RDNA 3.5 graphics, and XDNA 2 NPU.
AI Supercomputers and the HBM4 Rollout
AI supercomputers and HBM4 face scaling limits as advanced packaging, 3D integration, and supply constraints shape future memory performance.
Q1 2026 Smartphones: The BOM Fault Line
Q1 2026 smartphones market declines as rising component costs create a divide between winners and losers across the industry.
Bestechnic BES2800BP Wi-Fi 6/BT 5.4 Combo SoC Floorplan Analysis
Bestechnic BES2800BP SoC combines Cortex-M55, NPU, and wireless connectivity for compact devices with integrated processing, audio, and display.
Analysis: Huawei Watch Fit 5 Series: Design‑Led Differentiation in the 2026 Wearables Market
Huawei Watch Fit 5 boosts mid-range appeal with premium design, better displays, and higher component value, strengthening its smartwatch position.
The Chip Insider®–The New Intel Trinity. Hi-NA too expensive? The TSMC controversy and the inside story.
Latest Chip Insider report looks at Intel’s Q1 2026 earnings which reveal improved yields, strong leadership, and Hi-NA EUV debate—marking a potential turnaround vs. TSMC.
The AI Memory Crisis Is Reshaping the Tablet Market
AI memory shortages are reshaping tablets, forcing OEMs to raise prices, delay launches, and exit entry tiers as demand skews market dynamics.
Intel and AMD Refresh Desktop SoCs
Intel and AMD launched refreshed CPUs in 2026, with modest performance gains as Intel cut prices and AMD pushed higher‑end positioning.
Top Suppliers of Q1 2026 and Top-50 Semiconductor Suppliers of 2025
Top‑50 semiconductor suppliers grew 28% in 2025 on AI demand, with continued Q1 2026 momentum but rising geopolitical and trade risks.
Beijing Auto Show 2026: Key Trends Driving the Future of Automotive Transformation
Auto China 2026 reinforced China’s EV leadership, highlighting competition across charging, voltage levels, software, and powertrain standards.
A Clean Upswing: Wet Chemicals and Specialty Cleans Market Strengthens
Wet chemicals and specialty cleans revenues are set to reach $6,279 in 2026, supporting steady growth as semiconductor processing grows more complex.