Access a detailed look at JHICC’s first-generation 20 nm DRAM with our DPA of the 8 Gb CA4S8G16V die, including full analysis of its 25 nm stacked DRAM array.

Unlock accurate wafer price estimates using the IC and Strategic Cost and Price Models for clear, end-to-end cost insights.

Explore our package analysis of Samsung’s S5M5541 die from the Galaxy Z Flip7, offering insights for RF/IoT designers, foundries, and IoT OEMs comparing mixed-signal RF technologies.

Uncover how quartz component revenues are shifting across equipment segments and major applications, supported by data from 160+ suppliers.

Explore how China’s 2028 AEB mandate could impact ADAS standards and supply-chain resilience, with key implications for automotive electronics.

Discover how smartphone image sensor revenue grew over 10% driven by high-end demand, with Sony leading. Includes global shipments, revenue, and ASP trends through CY2025Q3.

See the latest Q3 2025 smartphone revenue trends as Apple and Samsung lead a market up 2% YoY. Get shipments, pricing, revenue, and price-tier share data for 28 vendors.

Uncover the Apple iPhone 17 Pro Max A3257 US with a detailed disassembly analysis, benchmarking, and cost insights from TechInsights in a graphics-rich format.feat

This report includes updated lead times data for the Automotive Semiconductor Supply, enhancing insights in the Online Data Report and Data Visualization.

This report analyzes the NVIDIA Blackwell HGX B200 GPU die's structure and materials, detailing fabrication methods and in-depth materials analysis.

The Sony IMX914 CMOS sensor, featured in the iPhone 17 Pro Max, offers 24 MP imagery with OIS and phase detection autofocus for stunning front camera photos.

Weekly semiconductor sales show growth both annually and weekly as of November 14, 2025, with a focus on various IC segments including NAND and DRAM.