SMIC runs Kirin 9030 on its N+3 node using DUV, proving scaled mobile logic, but limits make it unsuitable for large data center AI chips.

Foundry Q4 2025 revenues hit records at TSMC and SMIC, while GlobalFoundries and UMC show gradual recovery after 2023 declines.

Intel 18A vs TSMC 2nm shows grid carbon—not backside power—drives lower CO₂e per die, challenging efficiency and sustainability claims.

Nvidia posts Q4 FY2026 revenue up 73% YoY to $68.1B, driven by data‑center sales rising 75% on strong AI demand.

ARIA Sensing and ALGORIZED announce a strategic UWB collaboration at MWC, signaling new momentum in sensing and data‑driven applications.

Deep Dive Teardown of the Apple iPad Air 11" 2025, built on Apple Intelligence and featuring a Apple M3 processor.

Power Essentials report on MXP120A080FW from Vishay highlights its fast switching performance and transistor outline 247AD, 3-lead (TO-247AD 3L) package.

Power Integrations IMX2353F incorporates the industry’s first 1700 V gallium-nitride (GaN) power switch and uses a zero-voltage-switching (ZVS) flyback architecture.

This report reveals how GaN, SiC, and Si power devices are built, using deep imaging and material analysis to expose structure and process quality.

AFEM-8277 MHB RF PA module with LNA and duplexers supports 4G/5G, paired with AFEM-8254 in US iPhone Air A3260. for mid/high-band performance.

The Xiaomi XRING XP2210C, found inside the Xiaomi 15S Pro, is expected to optimize energy efficiency, battery performance, and charging control.

A Deep Dive report of the 2025 XPeng G6 (8525100FA1) audio amplifier delivers 960W of total output and features advanced digital signal processing, thermal efficiency, and compact packaging.