The ISP from the periphery region of the Galaxycore GC32E1, a back-illuminated (BI) CMOS Image Sensor (CIS) for mobile cameras, was extracted from the Tecno Spark 20 front camera.

The Canon LI5030SAC is a Bayer color, 6.4 μm, front-illuminated (FI) charge domain global shutter (GS) full frame (FF) CIS for machine vision applications, acquired as a standalone part.

The Samsung A35 5G is equipped with the Samsung Exynos 1380 processor, while its predecessor, the Samsung A34, offers the Mediatek Dimensity 1080. The Samsung A35 5G offers 6, 8, and 12 GB of RAM, while the Samsung A34 5G can be equipped with 4, 6, or 8 GB RAM.

Driven by the growth in both overseas and China market, Honor’s global smartphone shipment increased 34% YoY to 17.0 million units. It also took the leadership in China this quarter. Solid progress in overseas markets has been made with record higher contribution this quarter since the split from Huawei. Despite a slight fall on average selling price (ASP), Honor posted significant annual revenue growth in Q1 2024.

Analysis of the floorplan design used in the SAMSUNG K9AHGD8J0C (V9 PRIME Die) 133L 512 Gb TLC 3D NAND and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets. Process node and foundry identification, critical dimensions, memory and periphery functional block summaries and die/package cost analysis are provided.

The artificial intelligence (AI) arms race continues with key players AMD and Nvidia announcing competing products. The scale of deployments continues to expand, and the volume of required hardware is straining the supply chain and spurring new investments in advanced packaging production capacity.

Exploratory analysis results of a first ReRAM observations in a PMIC device: STMicroelectronics’ STWLC38 wireless charging receiver IC, including the process node and process type determination and a first look of the ReRAM structure.

Compared to the previous generation VR headset, the Oculus Quest 2, the Meta Quest 3 features upgraded hardware components. This includes a more powerful processor for improved performance, enhanced display technology for better visual fidelity, and upgraded tracking sensors for more accurate motion tracking.

The Memory Embedded and Emerging memory technology roadmap has been updated. Recently, industry leading emerging memory players such as TSMC, GlobalFoundries, Samsung, UMC, Fujitsu, Sony, Renesas, Everspin, and Avalanche introduced and revealed commercial STT-MRAM and ReRAM products used for the embedded memory applications.

The Quectel CC660D-LS is mainly based on MediaTek’s MT6825A. The CC660D-LS module offers versatile connectivity options, including L-band, S-band, and Band 23 connections. In addition, the module supports 3GPP Release 17 IoT non-terrestrial network (IoT-NTN) connections.

This is a Deep Dive Teardown of the Cadillac Lyriq front camera designed by ZF AG. The front camera is a part of the Cadillac Lyric safety and driver assistance system.

The demand for automotive sensors will grow at 3.8% CAAGR in dollar terms between 2023 and 2028, at a slower pace than in the April 2023 forecast as consumer sentiment for vehicle purchasing has fallen after the “cost of living crisis.” The report also highlights growth opportunities, such as in safety applications, and demand trends for sensors in OEM factory-fitted automotive electronic systems in vehicle production.