This Advanced Driver Assistance System (ADAS) market forecast shows strong growth, driven by legislation, NCAP regimes and a push towards more automated driving. Key changes in this update include a boost to future discrete ADAS demand due to slower adoption of centralized architectures than was previously expected. The market for ADAS technologies is thus now expected to grow at a CAAGR of 13.4% over 2023 to 2028, with content-per-vehicle increases boosting demand significantly more than the growth in vehicle production.

The race for the top wearables spot continues as Apple, Huawei, and Samsung battle it out. Global wearables shipments stabilized in Q1 2024, though still declined slightly, marking the sixth consecutive quarter of declines amid continued macroeconomic weakness and geopolitical uncertainty, causing a lengthening replacement cycle and limiting consumer spending.

Electric vehicle sales see continued growth, but not at the rate they have seen during 2023. The media has published articles that, in some cases, incorrectly show a decline in sales. This was among the topics discussed and presented at the Vehicle Electrification Expo (and adjacent Battery Cell Expo) at the National Exhibition Centre in Birmingham, UK, on May 15th-16th.

Chiplets, which break down large, integrated system-on-chips (SoCs) into smaller functional blocks, are positioned to revolutionize the semiconductor industry. By allowing different companies to design and optimize these smaller blocks, the chiplet approach enables more innovative and efficient designs.

Chiplets, which break down large, integrated system-on-chips (SoCs) into smaller functional blocks, are positioned to revolutionize the semiconductor industry. By allowing different companies to design and optimize these smaller blocks, the chiplet approach enables more innovative and efficient designs.

Earlier this month, the Department of Commerce announced plans to allocate $285 million toward the creation and operation of “a CHIPS Manufacturing USA institute focused on digital twins for the semiconductor industry,” promoting the development and sharing of digital twin technology to aid in semiconductor design, manufacturing, packaging, and testing.

The Fujitsu MB85AS12MT 12 Mb ReRAM die extracted from the MB85AS12MTPW-EAERE1 package. This Memory Floorplan Analysis Report (MFR) provides an analysis of the floorplan design used, the process node and foundry identification on the 40 nm process found in the MB85AS12MT 12 Mb ReRAM die.