The overall Datacenter Computing Processor market was $29.7 billion in Q1 2024, close to +200% year-over-year (3x), driven by stellar GPU shipments and sustained ASIC demand. The CPU and FPGA markets are bottoming out with accelerated year-over-year growth expected through 2024.

The Bosch MRR1Plus (5Q0 907561B) automotive radar sensor uses 77 GHz front-end radar transmitter and receiver ICs from Infineon.

In addition to the battery essentials report (BEF-2312-801) that recently provided important structural and morphological insights, this report presents a Battery Characterization (BCR) analysis of the Desay 26S1029 Li-ion battery extracted from the Amazon Echo Frames 3rd Generation smart glasses.

The market for smartphone fingerprint sensors secured over 5% revenue growth in Q1 2024. Qualcomm took the top spot followed by Goodix and Egis Technology in the quarter.

Insight into the structure of the STMicroelectronics VB1940 CMOS image sensor ISP die for automotive applications, which is a 5.1 MP, 1/2.5” stacked back-illuminated RGB/NIR technology CIS with a pixel pitch of 2.25 µm.

The Synaptics VideoSmart VS680 AI SoC found in Banana Pi BPI-M6 single board computer, using TSMC 12nm CMOS FinFET (likely 12FFC) process.

Quectel announced RG255C-GL module with 5G reduced capacity sub-6GHz on April 9, 2024 designed for global market. It is embedded with Qualcomm Snapdragon SDX35 Baseband Processor and JSFCBA3YH3BBG-425 RAM/NAND memory from Jeju Semiconductor.

Global smartwatch revenues fell by 4% YoY during Q1 2024. The decline was driven by slumping shipment volumes and declining ASPs due to macroeconomic weakness and geopolitical uncertainty limiting consumer demand and discretionary spending and causing a lengthening replacement cycle.

The models included in the report cover 90% of the total smartphone shipments in Q1 2024, including all major vendors as well as many locally significant microvendors.

This process analysis report examines the TF-SAW filter die, marked 122B050-A1, located in the 90SSPNWAM mid-high band power amplifier with an integrated low noise amplifier and duplexer (MHB L-PAMiD) within the Huawei Nova 12 Pro (ADA-AL00) 5G smartphone.

This report provides an analysis of the standard cells comprising about 70% of the area analyzed in the logic block of the Apple A17 Pro SoC CPU. Standard cells schematics are extracted to determine routing efficiency, gate density and global metal usage survey.

The HiSilicon Hi1105GFCV100 WiFi/BT/GNSS SoC was fabricated using HLMC’s 28nm HKMG planar RF CMOS process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.