This report presents a Digital Floorplan Analysis of the Samsung S5E9945 die found inside the Exynos 2400 component. The Exynos 2400 is the bottom package of SM-S926B/DS multi-chip package-on-package (PoP) assembly comprising the upper Samsung LPDDR5X memory package mounted on the Exynos 2400 application processor bottom package.

Realme C65 is a low range smartphone with 5G connectivity , large battery capacity, AI boost feature and ultra slim design in its range available for an Indian market. It comes with MediaTek Dimensity 6300 5G Application/Baseband processor and AI featured rear camera.

The global tablet applications processor (AP) market grew approximately 16 percent year-on-year growth in terms of revenue in Q1 2024 despite growing flat (0 percent) in processor shipment volume.

This report presents a Digital Floorplan Analysis of the 2RS9A die found inside Baidu KUNLUN-A2S1CAXGA component extracted from the Baidu Kunlun R200 artificial intelligence (AI) accelerator chip.

This report tracks handset vendor market share at the four major French operators -- Orange, SFR, Bouygues Telecom and Free Mobile -- from Q1 2009 to Q1 2024. The report is an important tool for measuring the health of individual handset brands at the operator level.

TechInsights report on the Windows on Arm reflects on Microsoft’s operating system collaboration with Arm, who find themselves in a “win now” position. Arm, along with telecom giant Qualcomm, have a limited but unique opportunity to draw the overwhelming majority of Microsoft’s marketing resources for their aspirations in the Surface market.

The Nordic TMRC83 die was found inside Nordic nRF54L15 Bluetooth 5.4 System-on-Chip (SoC). The nRF54L15 was extracted from the Fanstel EV-BM15 evaluation board with BM15M nRF54L15 Bluetooth 5.4 module.

Electromechanical category components price changes started to increase in Q2 2024 and is expected to continue for the next 3 quarters.

In the piece entitled, “Huawei Pura 70 Ultra - The Mobile Radio: What Works, Works!” we reported, based on our initial analysis, that the Pura 70 Ultra proves that Huawei knows it has a good 5G Radio design that is completely “made in China”. TechInsights has completed an analysis of the Mobile RF Architecture of the Huawei Pura 70 Ultra (EBD-2404-801) and the results do indeed corroborate our initial findings.

The Vivo X series is well known for its cutting-edge features and premium components, especially in display and camera quality. These characteristics help the Vivo X smartphones deliver outstanding gaming performance and better photo quality.

This report provides an overview into the structure of the OmniVision OV50K CIS. The analysis provides foundry identification and details of the fabrication process used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed, and is accompanied by a set of optical, SEM cross-section, and bevel images of both CIS and ISP dies.

This report tracks stand-alone and integrated tablet applications processor unit shipments, revenue market share and ASPs for 24 tablet apps processor chip vendors on a quarterly basis, and includes provisional estimates up to Q4 2024.