Stay ahead with TechInsights' Monthly Memory Pricing Update – track three-month trends and year-ahead projections across DRAM and NAND types, including Server DRAM, HBM, SSDs, and UFS.

Explore TechInsights' Top 10 Total IC Manufacturing Equipment Suppliers – a 2024 snapshot featuring company rankings, performance insights, market shifts since 2023, and key industry trends.

Get key insights on SMIC’s Q1 2025 demand and supply trends following a 28% YoY revenue growth to \$2.25 billion.

Explore TechInsights' Top 10 Assembly and Packaging Suppliers – a 2024 snapshot highlighting leading companies, market shifts since 2023, individual performance insights, and key trends shaping the segment.

Discover TechInsights' Assembly & Packaging Market Share Database – get quarterly and annual insights across key equipment segments. Track the market’s rebound in 2024 after two years of sharp decline.

Access TechInsights' Total Equipment Market Share Database for quarterly and annual insights on WFE, Test Connectivity, and Packaging & Assembly markets—covering ~200 global suppliers.

TechInsights expands IoT coverage with a new Chipset Market Tracker, offering unit and revenue data, vendor share insights, drivers, and strategic outlook.

Analysis of Winbond JAA123 20nm DRAM die in W664GG6RB-06 DDR4 package, featuring BCAT structure and detailed array-periphery layout for 4Gb density.

Semiconductor equipment order activity increased last week. This report accompanies the Industry Performance Data Table.

Semiconductor equipment orders rose last week amid a U.S.–China tariff truce, signaling cautious macroeconomic stabilization despite ongoing uncertainties.

RFIC process analysis of MediaTek BM11228A1 die in MT6199W FR1 RF transceiver, sourced from the vivo X200 Pro smartphone.

Package analysis of Avago AFEM-8264 RF module for 4G LTE & 5GNR, used with AFEM-8254 in Apple iPhone 16e (A3212) from the U.S.