Bluetooth headsets have become must-have products for many smartphone owners as vendors remove the 3.5 mm plug from their smartphones. China is the biggest market for True Wireless Stereo (TWS) and banded headsets, followed by the United Sates and India. Africa has emerged as one of the fastest-growing regions.

The following report by TechInsights on Telecom Operators Pioneering Use Cases for Generative AI brings a fresh, analytical perspective on the state of the telecom market and how vendors are adjusting to an influx of competition amid new smartphone features made possible with Generative AI. Everyday functions for departments found in every business are set to become automated with the help of Large Language Models.

Baidu and Samsung Electronics announced Baidu’s first cloud-to-edge AI accelerator, the Kunlun I chip. The Kunlun I accelerator covers diverse applications such as AI and HPC, manufactured using Samsung’s 14nm process technology.

The Core Ultra 7 155H is a desktop processor leveraging a disaggregated chiplet design strategy and Intel’s Foveros advanced packaging technology. The package incorporates four active chiplets (tiles) mounted to a passive interposer (base tile) using micro-bump interconnect.

The Google Tensor G3 is a package-on-package (PoP) assembly comprises a Micron LPDDR5 memory and the ZCF SoC. The Tensor G3 PoP was extracted from the Google Pixel 8 Pro smartphone.

The Samsung Galaxy A55 5G is a mid-range device from the Galaxy A series of smartphones. It has a 120Hz, 6.6" Super AMOLED display with a resolution of 1080 x 2340 pixels. The smartphone also features a 32 MP front camera, and three rear cameras (50 MP, 12 MP, and 5 MP).