This report contains a block level schematic of the Cellular RF paths from the antennae to the RF Transceiver. Passive components are also shown in the paths, however, the component values are not present.

xEV production is forecast to grow at a CAAGR of 13%, with volumes reaching 59.2 million units by 2031. The corresponding xEV powertrain electronics systems demand is forecast to grow at a CAAGR of 19% from $45.6 billion in 2023 to $108.0 billion in 2028 and reach $137.2 billion by 2031.

This report provides deeper insight on the advanced packaging innovations used in the manufacturing of the Apple R1. The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance or thermal management.

China’s BeiDou satellite system is not a typical GNSS system: its two-way short message and data communication capabilities are used in in the latest series of Huawei smartphones like Mate, X and Nova to provide emergency and casual Direct-To-Smartphone communication when cellular or Wi-Fi coverage is not available.

Intel has continued reducing the size of their integrated voltage regulators in yet another scaling evolution step introduced in their Sapphire Rapids product.

Smartphone shipments in Asia Pacific grew for the two consecutive quarters in Q1 2024. Shipment volumes grew 7.6% YoY to reach 146 million units. To all appearances, the three-year slump in the world’s largest regional market is over.

Global smartphone sales are expected to rise 3% YoY to 1.16 billion units in 2024. Android and Apple iOS are expected to maintain dual leadership in global smartphone market throughout the forecast period.

On Wednesday 12, June 2024, the European Commission confirmed the anticipated hike in import tariffs for Chinese battery electric vehicles (BEVs), destined to be implemented as soon as July 4th 2024. This report summarises the scope of the tariff hikes, the differences from the tariff increase imposed by the US in May of this year, and the likely implications of the increased duties on both EU and Chinese automakers.

The HPE ProLiant DL360 Gen11 server, manufactured by HP Enterprise, offers scalability for various workloads. Intel is the most cost driving manufacturer. For this device Intel provided CPU Subsystems and platform controller hub.

The communications semiconductor market faced significant challenges in Q1 2024, primarily due to inventory corrections throughout the value chain, combined with reduced capital expenditure by telecom operators and enterprises.

Analysis of the floorplan design used in the Zentel A3F4GH40ABF 25 nm 4 Gb DDR4 DRAM and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets.

Analysis of the floorplan design used in the Zentel A3F4GH40ABF 25 nm 4 Gb DDR4 DRAM and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets.