Global smartphone apps processors (AP) with on-device artificial intelligence (AI) increased 32 percent year-over-year in Q1 2024 as the mobile AI revolution takes hold of the industry. Qualcomm, MediaTek and Apple APs continue to dominate the absolute volume of on-device AI designs in Q1 2024 with MediaTek making significant gains with their latest Dimensity 9300. This report tracks quarterly shipments of key smartphone AI AP chips for major vendors, and includes provisional estimates up to Q4 2024.

The presented technologies included both software solutions and prototypes of vision devices supporting driving. This report is a summary of newly presented innovations and company profiles.

2023 saw just over 13M VR headsets ship. Hardware vendors shared just over $4B in wholesale revenues, led by Meta, which accounted for nearly 35% of all hardware revenues. This report examines the share of shipments, installed base, and revenues for each of the major platforms. These include Google Cardboard, Daydream, Samsung Gear VR, HTC, Oculus, Windows MR and Sony PSVR.

TechInsight’s latest smart home device forecast predicts global shipments of smart home devices will almost double between 2024 and 2030 to exceed 2.5 billion units at the end of this period.

TechInsights forecasts xEV production to grow at a CAAGR of 13%, with volumes reaching 59.2 million units by 2031. Sensor demand from xEV powertrain systems is forecast to grow at a CAAGR of 12% from $0.8 billion in 2023 to $1.4 billion in 2028 and reaching nearly $1.6 billion by 2031.

The Amazon Alexa Echo Hub G6A87E is an Alexa controlled device with a display/touchscreen, four microphones, and two speakers. The speakers are located at the top of the device. The Amazon Alexa Echo Hub G6A87E has 2 GB LPDDR4 SDRAM, 8 GB MLC NAND Flash Memory and the 64-Bit Hexa-Core application processor from MediaTek.

Efficient Power Conversion (EPC)’s EPC2619 E-Mode Sixth Generation GaN HEMT boasts improved device performance over EPC’s previous generation device and shows very competitive figures compared to other 100 V GaN HEMT devices. This blog discusses processing techniques and structures observed that can contribute to the device performance boost.

This report provides an insight into the structure of the OmniVision OX08D10 CMOS image sensor ISP die for automotive applications. The analysis provides foundry identification and a summary of the salient features observed that is accompanied by a set of SEM cross-section of the ISP die.

TechInsights forecasts xEV production to grow at a CAAGR of 13%, with volumes reaching 59.2 million units by 2031. Semiconductor demand from xEV powertrain systems is forecast to grow at a CAAGR of 15% from $10.5 billion in 2023 to almost $21.4 billion in 2028 and reaching $25.6 billion by 2031.

TechInsights predicts the server market will reach $273b by 2028, growing at a CAGR of 18%. Unlike recent years where server demand has been cyclical in nature and effected by the ebb and flow of refresh cycles, now a disruptive influence is stimulating growth: artificial intelligence.

Renesas launched its R-Car Open Access (RoX) development platform for software-defined vehicles (SDVs). Designed for the Renesas R-Car family of system on chips (SoCs) and microcontrollers (MCUs), the aim is to help Renesas’ OEM and Tier 1 customers to “shift left” their respective developments of software defined vehicle (SDV) platforms that will be underscored by the move towards battery electric vehicles (BEVs).