The SDR875-001 is part of Qualcomm’s Snapdragon 8 Gen 3 mobile platform, and delivers both FR1 and FR2 bandwidth transceiver functions in a single device. This is a new design strategy - previous platforms featured separately packaged transceivers - and this report examines the packaging details in support of the ‘converged’ device.

The Winbond WBGAA107X die was found inside Winbond W66CQ2NQUAFJ 2 Gb LPDDR4X DRAM package. Winbond is a specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, it is the only company in Taiwan with the ability to develop DRAM and flash products in-house.

The Xiaomi Smart Door Lock E20 is a Wi-Fi smart lock, designed with fingerprint, password unlock, NFC unlock, Bluetooth 5.0, eight 6V AA batteries, and 5V type-C emergency power.

This database provides a panoramic view of key battery cell manufacturers worldwide, covering the areas of their product roadmap, manufacturing capacity, relationships with OEMs and non-OEMs, as well as their raw material suppliers.

The Regional Technology and Innovation Hubs program aims to spread R&D capabilities throughout the US, expanding beyond Silicon Valley’s orbit.

Nokia, in its present incarnation as a telecom equipment vendor, was formed by a series of mergers & acquisitions, principally Nokia, Siemens Networks, Alcatel, Lucent, and Motorola’s cellular infrastructure group as well as some smaller acquisitions (Newbridge Networks, Ascend Communications etc.)

AI-capable notebook PCs - defined as a notebook PC that ships with a dedicated chipset built specifically to accelerate AI computing on device (i.e. an NPU) – will represent 95% of the total notebook PC market, or 227.3 million units, shipped in 2029.

This report provides a detailed analysis into the structure of the OmniVision OV50H CIS. The analysis includes structural and material analysis and details of the structural dimensions, which are used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed.

The overall Datacenter Computing Processor market was $29.7 billion in Q1 2024, close to +200% year-over-year (3x), driven by stellar GPU shipments and sustained ASIC demand. The CPU and FPGA markets are bottoming out with accelerated year-over-year growth expected through 2024.

The Bosch MRR1Plus (5Q0 907561B) automotive radar sensor uses 77 GHz front-end radar transmitter and receiver ICs from Infineon.

In addition to the battery essentials report (BEF-2312-801) that recently provided important structural and morphological insights, this report presents a Battery Characterization (BCR) analysis of the Desay 26S1029 Li-ion battery extracted from the Amazon Echo Frames 3rd Generation smart glasses.

The market for smartphone fingerprint sensors secured over 5% revenue growth in Q1 2024. Qualcomm took the top spot followed by Goodix and Egis Technology in the quarter.