This report is an overview of what is included within TechInsights: Smart Home Device Shipments to Exceed 2.5 Billion in 2023.

Global wearable revenues fell by 3% in Q1 2024 as macroeconomic weakness and geopolitical uncertainty caused lengthening replacement cycles and shrinking volumes for both smartwatches and fitness bands. ASPs remain elevated due to persisting inflation as well as product mix trending away from lower priced fitness bands and toward higher priced smartwatches.

Despite designing one of the first PC chipsets with a neural processing unit (NPU)—the M-series chip—and shipping millions of devices powered by it, Apple has been dodging questions on its AI strategy for the last year. Meanwhile, companies like Microsoft, Qualcomm, Intel, AMD, and Nvidia have been gleefully showing examples of how AI PCs powered by their silicon and software will change computing.

TechInsights took part in a session on automotive chiplets that was held at the SEMICON West event in San Francisco on 10th July 2024. Also presenting were representatives from IMEC, Bosch and MIPS. This analysis presents the TechInsights view of both the outlook for chiplets in automotive as well as some of the challenges that remain.

The Global Power Semiconductor market is estimated to be valued at $52.7 billion in 2023. Infineon are leading the market with an estimated power semiconductor revenue of $9.3 billion in 2023. They are followed by STMicroelectronics and Texas Instruments with $5.8B and $5.2B revenue respectively.

The Ray-Ban Meta Wayfarer Smart Glasses comes with a 12 MP ultrawide-angle camera that captures high-quality photos and videos and a five-mic array audio system that takes audio-rich immersive videos. The camera uses the SONY IMX681, which is a stacked Back-Illuminated (BI) CMOS image sensor (CIS) with 12 MP resolution and 1.00 µm pixel pitch.

The TMRV93 die was found inside the Apple APL1206 M4 processor. The Apple M4 component was extracted from the Apple iPad Pro released on May 7, 2024. The analysis includes structural analysis, critical dimensions, and layout analysis of digital blocks, along with die utilization calculations, including the total area for logic, I/O, memory, and analog components separately.

Huawei Pura 70 Pro+ is a premium smartphone from Huawei flagship Pura series. Designed with a HiSilicon Kirin 9010 octa core Applications/Baseband processor, a 5050 mAh battery with 100W super fast charge, a 50MP/12.5MP/48MP rear camera, and a 13 MP front camera.

As STMicroelectronics’ first automotive device in the new STPOWER MDmesh DM9 AG series, the STH60N099DM9-2AG, announced on March 11, 2024, features an N-channel 600 V Si SJ-MOSFET die which provides a maximum continuous source/drain (S/D) current of 27 A (at T = 25 °C) and a 76 mΩ typical source/drain (S/D) ON-resistance (RDS(ON)) at 10 V VGS bias.

Global fitness band industry revenues slowed their decline in Q1 2024, falling just 10% YoY after an average quarterly decline of 35% over the past 3 years. This marks the sixteenth consecutive quarter of fitness band revenue declines.

This report summarizes forecasts for the European market for xEV systems, semiconductors, and sensors. Despite uncertainties such as Ukraine conflict, semiconductor shortages, and a slowing global economy, the momentum towards electrification and battery electric vehicles remains robust, with volume demand continuing to rise.

The Qualcomm HG11-58812-110 was found inside Qualcomm QCN6402-001 Wi-Fi 7 RF transceiver. The QCN6402-001 was extracted from the Xiaomi RD15 Wi-Fi 7 mesh router. This router was launched in retail markets in January 2024.