Canon 3.2 MP Stacked SPAD Image Sensor Device Essentials Plus

This report provides a detailed analysis into the structure of the Canon LBC010 SPAD die. The analysis includes structural and material analysis and details of the structural dimensions, which are used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed.
18Jul

Galaxycore GC32E1 Device Essentials Plus

This report provides an extended insight into the structure of the Galaxycore GC32E1 CMOS image sensor (CIS). The analysis provides foundry identification and details of the fabrication process used to manufacture the image sensor, including a summary of the salient features observed, and accompanied by a set of optical, SEM cross-section, and bevel images of the CIS die.
18Jul

Component Price Landscape Q2 2024

In 2024, semiconductor sales started experiencing robust growth. The total market for semiconductors grew by 24% in the first half (1H) of 2024 and is expected to continue surging in the second half (2H) at a rate of 29%.
18Jul

July McClean Report

The July Update to the McClean Report reviews semiconductor industry capital spending and capacity. Semiconductor fabrication is an exceptionally capital-intensive process.
17Jul

Does AWS’s new Graviton 4 really deliver on price-performance?

AWS previewed its new Graviton4-based EC2 r8g instances at re:Invent 2023. It is now generally available in four AWS regions. The r8g offer 30% better performance and will be available in large instance sizes with up to 3x more vCPUs (up to 48xl) and memory (up to 1.5TB) than Graviton3-based r7g instances.
17Jul

Thailand xEV Market Demand Outlook 2022-2031

This report summarizes forecasts for the Thailand’s market for xEV systems, semiconductors, and sensors. Despite uncertainties such as the Ukraine conflict, semiconductor shortages, and a slowing global economy, the momentum towards electrification and battery electric vehicles remains robust, with volume demand continuing to rise.
17Jul

Loongson 3A6000 CPU Digital Floorplan Analysis

This CPU contains a quad-core 2.5 GHz LSA664 CPU, four 16 MB L3 cache memory, and two DDR4x memory controller. Look further into this digital floorplan analysis (DFR) to find out the process node, BEOL stack, bit cell usage, and manufacturing cost.
17Jul

Analysis: Smartphone Display Panel Market Share Q1 2024

The global smartphone display panel market experienced a dip in revenues of over 10% percent year-over-year in Q1 2024. The revenues fell on the back of declining panel ASPs and diminishing LCD market demand that impacted the performance of key display vendors in the period.
17Jul

Memory Pricing Report – July 2024

This monthly update delves into the dynamic and volatile pricing landscape of mainstream DRAM and NAND memory, offering an examination of pricing trends over the past three months and projecting developments for the upcoming year.
16Jul