Dive into our analysis of the SK hynix 238L 512 Gb TLC 3D NAND flash memory device found in the PC811 SSD.

Explore the SK hynix H25FTD0 die, featuring advanced 238-layer eighth-generation TLC 3D NAND flash memory.

Explore the future of smartphones with foldable displays, offering bigger screens in compact designs. Since 2019, brands like Samsung, Huawei, and others have driven the rising popularity of this innovation.

Discover key insights into 2024 wafer production costs, with most costs dropping due to lower energy prices. Learn about the exceptions, including SiC 150mm and Taiwan's rising electricity rates.

Get the latest 3D NAND update on Samsung, SK hynix, KIOXIA, WDC, Micron, and YMTC, including BiCS6, BiCS8, and Xtacking 3.0 & 4.0. For Memory and Storage Process subscribers.

Explore how Qualcomm gained a small lead in the cellular RF front-end market post-COVID, leveraging its modem-RF strategy and envelope amplifiers to outpace competitors like Skyworks and Qorvo.

Discover the STMicroelectronics ST-ONEMP PMIC, the world’s first digital controller with ARM Cortex M0+, offering advanced power management features.

Explore the Samsung Galaxy F15, a budget smartphone for India with a MediaTek 6100+ chip, 6000 mAh battery, triple cameras, and a 6.5-inch AMOLED display.

Discover Sheba Microsystems' innovative MEMS actuator solution for high-resolution automotive cameras, solving lens challenges by moving the sensor against a smaller, fixed lens.

Discover why automotive semiconductor supply is stable for the next 3 quarters but faces potential undersupply in late 2025 due to high wafer fabrication utilization. Stay informed on industry trends.

Explore the latest DRAM and NAND memory pricing trends—gain insights into the past three months and forecasts for the year ahead.