The advent of chiplets marks a fundamental change in semiconductor design and production, at a time when design costs are skyrocketing. A chiplet marketplace is expected to develop, where designers can mix match chiplets from a variety of suppliers to be produced at different foundries at the optimum process nodes.

TechInsights' 2024 Wired & Wireless Connectivity report will cover forecasts for USB, Bluetooth, Wi-Fi, NFC and wireless device charging. In addition, it will explore the emergence of Ultra wideband as an increasingly popular protocol for vehicle security and access solutions, as well as alternate uses such as occupant detection.

Samsung has introduced its latest set of mobile image sensor products for the key smartphone segments. These include the Samsung ISOCELL HP9, ISOCELL GNJ and ISOCELL JN5. These latest CIS products are set to become Samsung’s key CIS products that target key camera applications including, Wide, Ultrawide, Telephoto and Selfie cameras.

Notebook PC shipments in North America totaled 14.8 million units in the first quarter of 2024, a growth of 14% versus the same period a year ago, largely driven by early AI PC momentum.

With positive coverage at Computex and encouraging signs of market growth, is the PC back to having a formidable presence in the connected computing space? Or will a host of challenges stand in the way of a PC renascence?

Explore how Generative AI is revolutionizing the telecom industry by automating tasks, optimizing networks, and enhancing customer experiences.

This analysis discusses Apple’s company’s approach to its next-generation solution and related considerations for automakers and suppliers. Apple’s WWDC 2024 event, while focused primarily on the integration of artificial intelligence (generative AI), what is new in its iOS 18 mobile operating system, and a range of other topics, the company did provide an overview of its next-generation CarPlay solution.

This report presents a Digital Floorplan Analysis of the Broadcom BCM88920 die found inside the Broadcom StrataDNXTM Ramon3 Fabric Element device package. The BCM88920A0KFRBG package came to TechInsights as a standalone component.

This report presents a Basic Floorplan Analysis of the WUQI Microelectronics ID2 die found inside WUQI Microelectronics WQ7036AX component. The WUQI Microelectronics WQ7036AX component was extracted from the Huawei Eyewear 2 smart glasses.

Microsoft Surface Laptop Studio 2 is designed for business applications, built on Intel i7 13th Gen Applications Processor and NVIDIA graphics processor. The laptop designed with two cameras, a 14.4" 120Hz display/touchscreen system, and Kioxia 1TB SSD.

We kicked off our spotlight series with a technology perspective, underscoring the crucial role of advanced packaging and chiplets in meeting end market demands. The primary impetus for these demands stems from the datacenter processing requirements propelled by accelerated computing and artificial intelligence (AI).

The Samsung K9AKGD8J0B die features Samsung’s eighth-generation (V8) 236-Layer 3D NAND flash memory. The dies were extracted from the Samsung K9DYGY8J5B-CCK0 NAND flash packages, contained within the Samsung MZ-V9P4T0 990 PRO 4 TB SSD, released in September, 2023.