Loongson 3A6000 CPU Digital Floorplan Analysis

This CPU contains a quad-core 2.5 GHz LSA664 CPU, four 16 MB L3 cache memory, and two DDR4x memory controller. Look further into this digital floorplan analysis (DFR) to find out the process node, BEOL stack, bit cell usage, and manufacturing cost.
17Jul

Analysis: Smartphone Display Panel Market Share Q1 2024

The global smartphone display panel market experienced a dip in revenues of over 10% percent year-over-year in Q1 2024. The revenues fell on the back of declining panel ASPs and diminishing LCD market demand that impacted the performance of key display vendors in the period.
17Jul

Memory Pricing Report – July 2024

This monthly update delves into the dynamic and volatile pricing landscape of mainstream DRAM and NAND memory, offering an examination of pricing trends over the past three months and projecting developments for the upcoming year.
16Jul

Tracker: VALUE SHARE: Global Wearables Revenue and ASP by Vendor: 2024 Q1

Global wearable revenues fell by 3% in Q1 2024 as macroeconomic weakness and geopolitical uncertainty caused lengthening replacement cycles and shrinking volumes for both smartwatches and fitness bands. ASPs remain elevated due to persisting inflation as well as product mix trending away from lower priced fitness bands and toward higher priced smartwatches.
15Jul

Insight: “Apple Intelligence” Attempts to Take Back AI Leadership at WWDC 2024

Despite designing one of the first PC chipsets with a neural processing unit (NPU)—the M-series chip—and shipping millions of devices powered by it, Apple has been dodging questions on its AI strategy for the last year. Meanwhile, companies like Microsoft, Qualcomm, Intel, AMD, and Nvidia have been gleefully showing examples of how AI PCs powered by their silicon and software will change computing.
15Jul

Insight: Automotive Chiplets–The View from SEMICON West

TechInsights took part in a session on automotive chiplets that was held at the SEMICON West event in San Francisco on 10th July 2024. Also presenting were representatives from IMEC, Bosch and MIPS. This analysis presents the TechInsights view of both the outlook for chiplets in automotive as well as some of the challenges that remain.
15Jul

Power Semiconductor Market Share - 2Q 2023

The Global Power Semiconductor market is estimated to be valued at $52.7 billion in 2023. Infineon are leading the market with an estimated power semiconductor revenue of $9.3 billion in 2023. They are followed by STMicroelectronics and Texas Instruments with $5.8B and $5.2B revenue respectively.
15Jul

Sony IMX681 Device Essentials Folder

The Ray-Ban Meta Wayfarer Smart Glasses comes with a 12 MP ultrawide-angle camera that captures high-quality photos and videos and a five-mic array audio system that takes audio-rich immersive videos. The camera uses the SONY IMX681, which is a stacked Back-Illuminated (BI) CMOS image sensor (CIS) with 12 MP resolution and 1.00 µm pixel pitch.
15Jul

Apple M4 SoC Digital Floorplan Analysis

The TMRV93 die was found inside the Apple APL1206 M4 processor. The Apple M4 component was extracted from the Apple iPad Pro released on May 7, 2024. The analysis includes structural analysis, critical dimensions, and layout analysis of digital blocks, along with die utilization calculations, including the total area for logic, I/O, memory, and analog components separately.
15Jul

Huawei Pura 70 Pro+ (HBN-AL10) Deep Dive Teardown

Huawei Pura 70 Pro+ is a premium smartphone from Huawei flagship Pura series. Designed with a HiSilicon Kirin 9010 octa core Applications/Baseband processor, a 5050 mAh battery with 100W super fast charge, a 50MP/12.5MP/48MP rear camera, and a 13 MP front camera.
12Jul