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  1. Home

Latest Blogs and Commentary

March 05, 2024

Japan: Smartphone Shipments & Marketshare by Model: Q4 2023

Japan is the world's fourth largest smartphone market by value. It delivers high revenues to device makers, component suppliers, and operators. Our extensive report shows the top-50 best-selling smartphone models in Japan in the fourth quarter of 2023. Besides popular Apple, Google, Sharp, and Sony flagships, which brands and models have made their way into the bestsellers list, and what is the secret behind their success?

March 05, 2024

RF Industry Review Q4 2023: Financials

With an uptick in mobile phone shipments in Q4, sales increased an average of 5.4% for radio component suppliers reporting results. Despite this, median profitability as defined by net income divided by sales decreased slightly from 10% to 8% sequentially for the companies in our sample.

NAND Sales jumped 48% YoY the week ending Feb 23, 2024

March 04, 2024

NAND Sales jumped 48% YoY the week ending Feb 23, 2024

Semiconductor sales were up 4% last week and increased 20% from this time last year. Zooming in on NAND IC, the 13-week MA jumped 48% YoY last week. TechInsights forecasts NAND IC sales will increase 73% to $68 billion in 2024.

Spring Blossoms with Optimism (Upgraded 2024 IC Forecast)

March 04, 2024

Spring Blossoms with Optimism (Upgraded 2024 IC Forecast)

There were some major changes to our IC forecast this month. IC sales are now expected to surge nearly 24% in 2024 compared to 16% in the last update. The major driver for this significant change was Memory, where sales were upgraded to a whopping 71% from 41% in the previous update.

The Chip Insider®– Gordon Moore Tribute - SPIE ALP

March 04, 2024

The Chip Insider®– Gordon Moore Tribute - SPIE ALP

Like in The Wizard of Oz, we were told to follow a yellow brick road -- ours paved with gold. It's a road where the wicked witch of fizzled-out technology -- like x-ray and 157nm -- lurk to stop us. And there were plenty of unknowns. We would have been stopped dead in our tracks had we not broken through Robert Doering's Red Brick Walls on the roadmap.

Consumer Electronics Trends

March 04, 2024

Consumer Electronics Trends

Dive into consumer electronics trends and expert insights on AI, gaming, smart home tech, and more. Download now and stay ahead of the curve.

Renesas SoC Targets Location Tracking

March 01, 2024

Renesas SoC Targets Location Tracking

The DA14592 is Renesas’s smallest multicore BLE SoC, featuring a power-thrifty radio transceiver that drops power by more than 23% for send and receive compared with Renesas’s other BLE chips.

Neureality Builds DPU for AI

March 01, 2024

Neureality Builds DPU for AI

NeuReality, an Israeli startup, is building an offload engine for AI-application pre- and postprocessing that removes the need for a CPU in a server and works directly with an accelerator.

BrainChip Adds Temporal Networks

March 01, 2024

BrainChip Adds Temporal Networks

Edge-AI vendor BrainChip has updated its Akida event-based IP offering. Its new Akida 2 architecture, available only as IP, supports temporal networks and Transformer encoders at low power.

MWC-TCL wins praise for NXTPAPER displays

March 01, 2024

MWC 2024: TCL wins praise for NXTPAPER displays and Lenovo’s welcome move towards a sustainable future

TCL's NXTPAPER Tablets: TCL impresses with NXTPAPER technology, offering eye-friendly displays. Priced at $549, the NXTPAPER 14 Pro, powered by MediaTek's Dimensity 8020, expands to more markets in 2024.

Telecom Trends

March 01, 2024

Telecom Trends

Unlock the future of telecom with the 2024 Telecom Trends report. Explore 11 key industry shifts, from 5G Advanced to AI integration, offering opportunities and strategies for success.

MWC-Next wave of technologies-6G, RedCap, AI and Industry 5.0

March 01, 2024

MWC2024: Next wave of technologies-6G, RedCap, AI and Industry 5.0

MWC 2024 showcased intense discussions on cutting-edge technologies. AI took the lead, dominating conversations along with 6G, RedCap, and Industry 5.0. Key takeaways.

March 01, 2024

Toshiba TH58LKT3V46BA8S (KIOXIA/Western Digital Corp. FXZ0_1T die) 162-Layer 3D NAND Flash Memory Advanced Memory Essentials

This is an Advanced Memory Essentials (AME) summary document of the Toshiba TH58LKT3V46BA8S (KIOXIA/Western Digital Corporation FXZ0_1T die). This sixth-generation 3D flash memory based on the bit cost scalable flash technology (BiCS6) features advanced architecture beyond conventional eight-stagger memory hole array.

Survey Plus Teardown of the Samsung Galaxy A25 5G SM-A256E/DSN Smartphone

March 01, 2024

Survey Plus Teardown of the Samsung Galaxy A25 5G SM-A256E/DSN Smartphone

The Samsung Galaxy A25 5G is a device from the Galaxy A series which is a line of mid-range smartphones. It has a 6.5" Super AMOLED display with a resolution of 1080 x 2340 pixels and a 120 Hz refresh rate.

Deep Dive Teardown of the Huawei MDC Pro 610 ADAS Controller 3600080-EP50 Automotive

March 01, 2024

Deep Dive Teardown of the Huawei MDC Pro 610 ADAS Controller 3600080-EP50 Automotive

The Huawei MDC Pro 610 ADAS Controller is a smart driving domain controller capable of processing environmental information collected by sensors. It performs fusion, identification, and classification tasks. Additionally, it handles map positioning for path planning and driving decision-making, enabling precise control of the vehicle and autonomous driving.

March 01, 2024

Global Internet Device Installed Base Forecast 2018–2028: A Summary

In 2023 Smart Home devices overtook Smartphones to become the second largest Internet connected device domain after Internet of Things (IoT). This report complements and discusses the recently published Global Connected and IoT device Installed Base forecast report covering the entire universe of Internet connected products including Smartphones, Mobile PC and Tablets, Smart TVs, Game Consoles, Digital Media Streamers, Wireless Speakers, and more.

March 01, 2024

Basic Floorplan Analysis (BFR) of the Silicon Labs EFR53000A0 Die

This report contains detailed information on the Silicon Labs EFR53000A0 die including selected teardown photographs, measurements of vertical and horizontal dimensions of major microstructural features, and cost of die and tested packaged die.

Deep Dive Teardown of the Nokia HMD Global X30 5G TA-1450 Smartphone

February 29, 2024

Deep Dive Teardown of the Nokia HMD Global X30 5G TA-1450 Smartphone

The Main Frame in Nokia X30 5G is made of aluminum (41.90g). To make the shape of the Main Frame producer used machine processing anodizing, laser printing, and spot welding. The average weight of used plastic in the Nokia X30 5G main enclosure is 11.5g.

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