Latest Blogs and Commentary
ANALYSIS: Global 5G and mmWave Smartphone Shipments Forecast by Region to 2025
The 5G honeymoon period is over. Global 5G smartphone shipment growth remained low in 2023 due to economic turbulence. Growth is stagnating due to Chinese softness, and geopolitical and economic turbulence. Apple leads vendors with an over one-fourth share of all 5G shipments globally, followed by Samsung and Xiaomi. By 2025 Apple’s lead will have shrunk as Samsung grows its shipments faster than the other leading vendors. 5G mmWave devices continue to exist mainly in the North American and Japanese markets.
NVIDIA's Blackwell Platform: Powering AI with Advanced Electronics
NVIDIA's unveiling of the Blackwell Platform at GTC 2024 has sparked industry-wide excitement, showcasing the company's prowess in AI computing.
Automotive Market Outlook Webinar Series
Anticipate and adapt to automotive semiconductor landscape changes with market projections, emerging tech insights, and key demand drivers. Gain valuable foresight now.
Data-Center AI Chip Market – Q1 2024 Update
The data-center AI chip market expanded beyond anyone’s wild imagination in 2023. NVIDIA tripled its revenue and reached a two trillion dollar valuation in the stock market. The demand for GPUs continued to make headlines with supply being the constraint for the growth.
Global Smartwatch Vendor Market Share by Region: Q4 2023
Global smartwatch shipments declined for the fifth consecutive quarter during Q4 2023, after Q4 2022 marked the first YoY decline since 2016 as the smartwatch space begins to mature and consumers reign in discretionary spending causing a lengthening replacement cycle amid macroeconomic weakness.
Apple iPad Model Tracker 4Q 2023: Big Changes Expected in 2024 Refresh
Apple is rumored to launch new iPad Pro models with the M3 chip and even new iPad Air models in late March 2024, kicking off a year of iPad updates. These will be important updates to Apple’s portfolio and should be cast in the new light of what is possible with on-device AI to reinforce the messaging that iPads are PC replacements as well as entertainment devices.
Deep Dive Teardown of the Bosch 2022 Peugeot 208 Head Unit 9841575880 Automotive
The PSA RCC A1 is a head unit designed for PSA Group (now Stellantis) cars. This model was mounted in a 2022 Peugeot 208. It features AM/FM and DAB radio, Bluetooth 4.0, and USB 2.0 connectivity. The head unit supports four 50 W speakers and a rear-view camera.
Deep Dive Teardown of the H3C Magic BE18000 WiFi Router
The H3C Magic BE18000 is one of the first Wi-Fi 7 (802.11be) routers on the market. It is powered by Qualcomm’s chipset and a 2.2 GHz quad-core processor + 1 GB of RAM and 128 MB of storage. It uses MU-MIMO in 2.4 and 5GHz WiFi bands and there are 16 antennas inside (4x2.4GHz MIMO omnidirectional antennas + 3 sets of 5GHz MIMO directional antennas).
Unlocking Insights: First PMIC Video Briefing of 2024 Released!
In this briefing we focus in depth on a highly integrated PMIC designed for multi-port charging applications from Infineon, the CYPD7271-68LQXQ. It incorporates an ARM® Cortex®-M0 32-bit MCU, 128 KB Flash, 32 KB ROM, 16KB SRAM and power devices all on a single die with the embedded flash observed to be a silicon-oxygen-nitrogen-oxygen-silicon (SONOS) design.
Highlights from the NVIDIA GTC Conference
Discover the latest advancements and insights unveiled by NVIDIA in our blog, keeping you informed on cutting-edge technology and developments in the tech industry.
Unveiling the Logic Advanced Packaging Briefing
Three times a year we curate important updates, supplementary analysis of recent reports, high-level packaging process flows, and sneak peeks at upcoming devices and packaging reports. The result is an Advanced Packaging Analyst’s Briefing, and this year it has a new video format, the first of which is now available on-demand to our subscribers.
The Chip Insider®– Apple’s decision tree for killing its Autonomous Vehicle
By now, you’ve surely read plenty about the quiet canceling of Apple’s Titan AV effort. Most of the focus has been on what it means for Apple. This Chip Insider® steps back to see the darker picture Titan’s fall from grace paints about the future of AVs.
UK Handset Vendor Marketshare by Operator: Q4 2023
We estimate 6.7 million handsets were shipped in the UK in Q4 2023, growing by 8% YoY. Apple maintained its position as the number one handset vendor across all four major UK operators during the quarter, largely boosted by the strong demand of the iPhone 14 / 15 series. Samsung trailed Apple across four major UK operators during the quarter. While Xiaomi defended number three position in the UK market, Oppo continued to lose momentum. This report tracks quarterly handset vendor market share at the four major UK operators -- EE, Vodafone, O2 and Three -- from Q1 2009 to Q4 2023.
Nexperia NSF040120L3A0 1200V 40mΩ N-channel SiC Power MOSFET Power Essentials Analysis
This report presents a Power Essentials analysis of the Nexperia NSF040120L3A0 silicon carbide (SiC) power MOSFET. The NSF040120L3A0 power package features a N-channel 1200 V SiC power MOSFET device which provides a maximum continuous source/drain (S/D) current of 65 A (at T = 25 °C) and a 40 mΩ typical S/D ON-resistance (RDS(ON)) and is designed for high power and high voltage industrial applications.
Renesas Presses MCU Performance Lead
With the expansion of the RA8 series, Renesas is integrating Arm’s highest-performing Cortex-M CPU in microcontrollers optimized for graphics display and motor control applications.
Analysis: Apple iPad Model Tracker Q4 2023 – Expect Big Changes in 2024 as Apple Refreshes the iPad
As economic conditions improved in the second half of 2023, so too did tablet demand. However, with a product portfolio not updated since late 2022, low refresh demand for iPad held back a stronger recovery.
NVIDIA Goes All In on Generative AI
NVIDIA's latest unveilings represent a significant leap forward in technological innovation across various domains. The introduction of the Blackwell GPU, while lacking specific performance metrics, hints at enhanced capabilities, especially with its integration into the DRIVE THOR SoC.
Intel SRMZ1 Core Ultra 7 8PNRC (SoC Tile) TSMC 6nm FinFET Digital Floorplan Quick Look
The SRMZ1 is a 3D packaging assembly comprising a side-by-side arrangement of four dies, including system-on-chip (SoC) die with die makings 8PNRC, mounted on a common interposer placed on the package wiring board (PWB) employing Intel’s 3D Performance Hybrid Architecture packaging technology. SRMZ1 application processor was extracted from the Acer 14" Swift Go 14 multi-touch laptop.