Latest Blogs and Commentary
Unveiling the Logic Advanced Packaging Briefing
Three times a year we curate important updates, supplementary analysis of recent reports, high-level packaging process flows, and sneak peeks at upcoming devices and packaging reports. The result is an Advanced Packaging Analyst’s Briefing, and this year it has a new video format, the first of which is now available on-demand to our subscribers.
The Chip Insider®– Apple’s decision tree for killing its Autonomous Vehicle
By now, you’ve surely read plenty about the quiet canceling of Apple’s Titan AV effort. Most of the focus has been on what it means for Apple. This Chip Insider® steps back to see the darker picture Titan’s fall from grace paints about the future of AVs.
UK Handset Vendor Marketshare by Operator: Q4 2023
We estimate 6.7 million handsets were shipped in the UK in Q4 2023, growing by 8% YoY. Apple maintained its position as the number one handset vendor across all four major UK operators during the quarter, largely boosted by the strong demand of the iPhone 14 / 15 series. Samsung trailed Apple across four major UK operators during the quarter. While Xiaomi defended number three position in the UK market, Oppo continued to lose momentum. This report tracks quarterly handset vendor market share at the four major UK operators -- EE, Vodafone, O2 and Three -- from Q1 2009 to Q4 2023.
Nexperia NSF040120L3A0 1200V 40mΩ N-channel SiC Power MOSFET Power Essentials Analysis
This report presents a Power Essentials analysis of the Nexperia NSF040120L3A0 silicon carbide (SiC) power MOSFET. The NSF040120L3A0 power package features a N-channel 1200 V SiC power MOSFET device which provides a maximum continuous source/drain (S/D) current of 65 A (at T = 25 °C) and a 40 mΩ typical S/D ON-resistance (RDS(ON)) and is designed for high power and high voltage industrial applications.
Renesas Presses MCU Performance Lead
With the expansion of the RA8 series, Renesas is integrating Arm’s highest-performing Cortex-M CPU in microcontrollers optimized for graphics display and motor control applications.
Analysis: Apple iPad Model Tracker Q4 2023 – Expect Big Changes in 2024 as Apple Refreshes the iPad
As economic conditions improved in the second half of 2023, so too did tablet demand. However, with a product portfolio not updated since late 2022, low refresh demand for iPad held back a stronger recovery.
NVIDIA Goes All In on Generative AI
NVIDIA's latest unveilings represent a significant leap forward in technological innovation across various domains. The introduction of the Blackwell GPU, while lacking specific performance metrics, hints at enhanced capabilities, especially with its integration into the DRIVE THOR SoC.
Intel SRMZ1 Core Ultra 7 8PNRC (SoC Tile) TSMC 6nm FinFET Digital Floorplan Quick Look
The SRMZ1 is a 3D packaging assembly comprising a side-by-side arrangement of four dies, including system-on-chip (SoC) die with die makings 8PNRC, mounted on a common interposer placed on the package wiring board (PWB) employing Intel’s 3D Performance Hybrid Architecture packaging technology. SRMZ1 application processor was extracted from the Acer 14" Swift Go 14 multi-touch laptop.
Survey Plus Teardown of the Samsung S24 Ultra SM-S928B/DS
The Samsung Galaxy S24 Ultra comes with a custom version of Qualcomm's high-end chipset - Snapdragon 8 Gen 3. This phone has a 5,000mAh battery with support for 45W fast charging. The SIM card tray can handle two nano-SIM cards.
Data-Center AI Chip Market 2023 Year-End and Q4 2023 Update
This document summarizes quarterly update (Q4/23) from companies like DC AI Chips, Nvidia, Intel and AMD, and key yearly updates (2023) for the data center AI chip market.
Samsung Unveils First Imager Featuring Hybrid Bond Technology
Unlock the future of imaging technology with TechInsights' groundbreaking discovery: Samsung's inaugural imager boasting innovative hybrid bond technology.
China: Smartphone Shipments & Marketshare by Model: Q4 2023
China is the world's largest smartphone market. It delivers high volume and revenue to device makers, component suppliers and operators. Our extensive report shows the top-100 best-selling smartphone models in China in the fourth quarter of 2023. Besides popular Apple, Honor, Oppo, Vivo, and Xiaomi models, which brands and models have made their way into the bestsellers and what is the secret behind their success?
Germany Handset Vendor Marketshare by Operator: Q4 2023
We estimate 6.2 million handsets were shipped in Germany in Q4 2023, declining by -2% YoY during the quarter. Apple captured the leading positions across all major carriers in Germany ahead of Samsung. Xiaomi maintained its standing while Oppo lost the ground due to patent issues. vivo and Realme as well as Oppo shipped no new smartphones during the quarter.
Smartphone Vendor Marketshare for 'Next 60' Countries: Q4 2023
Global smartphone shipments grew by 7% annually YoY in Q4 2023. The sixty countries tracked in this report accounted for 91% of these global shipments. Apple was the largest vendor and was followed by Samsung on consolidated shipments to these markets.
AI-Capable Notebook PC Shipments Forecast by Region and OS 2023-2029: 1Q 24
AI-capable notebook PCs - defined as a notebook PC that ships with a dedicated chipset built specifically to accelerate AI computing on device (i.e. an NPU) – will represent 95% of the total notebook PC market, or 230.5 million units, shipped in 2029.
Prophesee GenX320ES Event-Based Metavision Sensor Mixed Signal ISP Die Advanced Floorplan Analysis
This report presents an advanced floorplan analysis of the image signal processor (ISP) die from the Prophesee GenX320ES, 1/5″ format, 320 ×320 pixels resolution, 6.3 μm pixel pitch, stacked back-illuminated event-based Metavision® CMOS image sensor for embedded vision and power-sensitive applications.
Beken BK3296 22nm Bluetooth Audio SoC Process Analysis
This report provides an analysis of the structure and materials used in the manufacture of Beken BK3296 22nm Bluetooth Audio SoC manufactured in UMC's 22nm ULP process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
3D NAND Technology Roadmap
Gain exclusive access to TechInsights' comprehensive 3D NAND Technology Roadmap, guiding you through the ever-evolving landscape of innovation.
