Latest Blogs and Commentary
Smartphone On-Device AI Chip Market Model Q1 2024: New emphasis on Mobile AI to Increase NPU size and overall chip costs
Global smartphone apps processors (AP) with on-device artificial intelligence (AI) increased 32 percent year-over-year in Q1 2024 as the mobile AI revolution takes hold of the industry. Qualcomm, MediaTek and Apple APs continue to dominate the absolute volume of on-device AI designs in Q1 2024 with MediaTek making significant gains with their latest Dimensity 9300. This report tracks quarterly shipments of key smartphone AI AP chips for major vendors, and includes provisional estimates up to Q4 2024.
Autonomous Vehicle Technology Expo 2024 – Towards Safety and Cost Optimization
The presented technologies included both software solutions and prototypes of vision devices supporting driving. This report is a summary of newly presented innovations and company profiles.
Tracker: Global VR Headset Platform Share 2014-2023
2023 saw just over 13M VR headsets ship. Hardware vendors shared just over $4B in wholesale revenues, led by Meta, which accounted for nearly 35% of all hardware revenues. This report examines the share of shipments, installed base, and revenues for each of the major platforms. These include Google Cardboard, Daydream, Samsung Gear VR, HTC, Oculus, Windows MR and Sony PSVR.
Cedric Malaquin
As the Service Director of Radio Frequency and Wireless Components at TechInsights, Cédric Malaquin brings over 20 years of experience in the semiconductor industry. Cédric is a technology enthusiast, driven by a need to discover all there is to know behind the data.
Stacy Wegner
Stacy Wegner is the Senior Technology Analyst at TechInsights’ Teardown division, responsible for ensuring the highly technical data produced by our analysts is transformed into consumable competitive intelligence. Stacy has an extensive background in advanced technology devices, marketplace analysis, and TechInsights products and practices.
Teardown Unboxing: Exploring the Vivo X Fold3 Pro
Explore the innovative design and advanced features of the Vivo X Fold3 Pro, the thinnest foldable smartphone on the market. Learn about its durable carbon fiber hinge, Vivo Armor architecture, and premium aesthetics in our detailed Teardown and analysis.
Apple Vision Pro: Exploring the Design and Sustainability of Its Innovative Battery Pack
In 2024, Apple launched its groundbreaking AR/VR system, the Apple Vision Pro, featuring a notable departure from conventional designs with its external battery pack.
The Chip Insider® – China’s Semiconductor industry in failure phase
What’s Happening and What’s the Meaning: China’s Semiconductor industry enters failure phase… it’s not time to do a victory lap.
Insight: Smart Home Device Shipments to Exceed 2.5 Billion in 2030
TechInsight’s latest smart home device forecast predicts global shipments of smart home devices will almost double between 2024 and 2030 to exceed 2.5 billion units at the end of this period.
Global xEV Sensor Demand Forecast for 2022–2031
TechInsights forecasts xEV production to grow at a CAAGR of 13%, with volumes reaching 59.2 million units by 2031. Sensor demand from xEV powertrain systems is forecast to grow at a CAAGR of 12% from $0.8 billion in 2023 to $1.4 billion in 2028 and reaching nearly $1.6 billion by 2031.
Deep Dive Teardown of the Amazon Alexa Echo Hub G6A87E Smart Display
The Amazon Alexa Echo Hub G6A87E is an Alexa controlled device with a display/touchscreen, four microphones, and two speakers. The speakers are located at the top of the device. The Amazon Alexa Echo Hub G6A87E has 2 GB LPDDR4 SDRAM, 8 GB MLC NAND Flash Memory and the 64-Bit Hexa-Core application processor from MediaTek.
Advanced Processing and Structures for Device Performance Boost in EPC2619 E-Mode Sixth Generation GaN HEMT
Efficient Power Conversion (EPC)’s EPC2619 E-Mode Sixth Generation GaN HEMT boasts improved device performance over EPC’s previous generation device and shows very competitive figures compared to other 100 V GaN HEMT devices. This blog discusses processing techniques and structures observed that can contribute to the device performance boost.
Omnivision OX08D10 Standard Floorplan Analysis
This report provides an insight into the structure of the OmniVision OX08D10 CMOS image sensor ISP die for automotive applications. The analysis provides foundry identification and a summary of the salient features observed that is accompanied by a set of SEM cross-section of the ISP die.
Ryzen AI 300 Claims Lead in PC TOPS
AMD’s Strix Point processors integrate an NPU capable of 50 TOPS with the new Zen 5 CPU capable of 16% better IPC and an upgraded GPU.
xEV Global Semiconductor Demand Outlook 2022-2031
TechInsights forecasts xEV production to grow at a CAAGR of 13%, with volumes reaching 59.2 million units by 2031. Semiconductor demand from xEV powertrain systems is forecast to grow at a CAAGR of 15% from $10.5 billion in 2023 to almost $21.4 billion in 2028 and reaching $25.6 billion by 2031.
AI drives server market growth to $270b by 2028
TechInsights predicts the server market will reach $273b by 2028, growing at a CAGR of 18%. Unlike recent years where server demand has been cyclical in nature and effected by the ebb and flow of refresh cycles, now a disruptive influence is stimulating growth: artificial intelligence.
Global Smartphone Installed Base Forecast by Operating Systems for 88 Countries: 2007 to 2029
TechInsights smartphone research team predicts global smartphone installed base will grow 2% YoY in 2024 and 2025. The growth rate will be modestly improved from 2026 through 2029 driven by technology innovations and the penetration of on-device AI smartphones. Android and Apple are expected to retain market leadership with shares of 82% and 16% in 2024, respectively.
Insight: Renesas RoX Development Platform to “shift left” SDV Deployment
Renesas launched its R-Car Open Access (RoX) development platform for software-defined vehicles (SDVs). Designed for the Renesas R-Car family of system on chips (SoCs) and microcontrollers (MCUs), the aim is to help Renesas’ OEM and Tier 1 customers to “shift left” their respective developments of software defined vehicle (SDV) platforms that will be underscored by the move towards battery electric vehicles (BEVs).
