The Apple Vision Pro augmented reality headset uses four inferred cameras to track its wearer’s eyes. This report catalogues the structure of those camera modules, how they fit into the headset, and provides an overview of the Sony back-side illuminated CMOS image sensor that they house.
The OmniVision OX03D4C is a color, 3-megapixel (MP) resolution stacked back-illuminated (BI) CMOS image sensor (CIS) with a 1/4-inch optical format, LED flicker mitigation (LFM), and 140 dB high dynamic range (HDR) for automotive applications.
The Ouster OS1 Mid-Range High-Resolution Imaging LiDAR incorporates the new REV7 sensor that uses the L3 Digital LiDAR Chip. This L3 chip is a stacked back-illuminated (BI) direct time-of-flight (d-ToF) fabricated by STMicrolectronics. The L3 chip uses single photo avalanche diode (SPAD) pixels to analyze the IR signal that is returned to the LiDAR from the emitting source located in the LiDAR.
Unlock the future of imaging technology with TechInsights' groundbreaking discovery: Samsung's inaugural imager boasting innovative hybrid bond technology.
This report presents an advanced floorplan analysis of the image signal processor (ISP) die from the Prophesee GenX320ES, 1/5″ format, 320 ×320 pixels resolution, 6.3 μm pixel pitch, stacked back-illuminated event-based Metavision® CMOS image sensor for embedded vision and power-sensitive applications.