TechInsights' Semiconductor Analytics Report

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This database tracks the quarterly performance of the top pay TV providers in North America for the 1Q 2018 to 3Q 2023 time-period.

This market forecast highlights the growth opportunities for semiconductors used in Advanced Driver Assistance Systems (ADAS). Key changes include an acceleration of the demand for blindspot detection systems.

The Chip Insider Graphics

This Advanced Packaging Quick Look report (APQ) provides insight on the advanced packaging innovations used in the manufacturing of the Apple A17 mobile handset processor.

This is a Power Essential Analysis (PEF) of the onsemi NVH4L022N120M3S device of the M3S family. The NVH4L022N120M3S EliteSiC is a 1200 V, single N-channel enhancement-mode silicon carbide-based power MOSFET.

This report is a Basic Floorplan Analysis (BFR) of the Broadcom BCM4398 die found inside the Universal Scientific Industrial G5-602550 component. The BCM4398 die was manufactured on 300 mm wafers using TSMC's 7 nm HKMG finFET CMOS process.

Concluding 20 months of an often-contentious approval process with regulators in the US, EU, UK, and New Zealand, including defeating the Federal Trade Commission in a US federal court and restructuring the deal to appease the Competition and Markets Authority (CMA) in the UK, Microsoft closed its acquisition of Activision Blizzard, publisher of Call of Duty, World of Warcraft, and Diablo. This report examines the implications of this merger.

Global smartphone shipments went down -0.3% YoY at 296 million units in Q3 2023. It is notable that the annual decline rate has largely stabilized / improved from previous quarters, indicating the bottom might have already reached, and a mild rebound is expected in 2024.