Global game console shipments grew by 11% year-on-year to reach 9.1 million units in Q3 2023. Sony displayed Nintendo to claim its leadership position, witnessing highest Q3 shipments ever, thanks to the promotional price correction of PS5, increased sales of third-party games and ad on content performance.

As per the manufacturer's specifications, this Tesla Glovebox SSD drive is designed to store all data utilized in Tesla cars, including arcade games and dashcam footage. It functions as an SSD drive that connects to the vehicle through a USB Type A 3.1 Gen 2 connector, boasting a storage capacity of 1 TB.

The Revvl 6X 5G follows conventional design for budget phones, in which the cast frame with some co-molded plastic parts has an additional plastic frame latched onto it and has an adhesive surface for attaching the back cover.

Qualcomm has the most design wins for the Quectel BG96 device including the MDM9206 LTE modem, Power Management, and RF Transceiver with GPS. The RF Design is based on solutions from Qorvo with two IC’s – Dual Band 3G Power Amplifier Module and Quad-Band GSM Transmit Module with Antenna Switches.

This is a power essentials analysis (PEF) of the Qorvo PAC22140-T power management integrated circuit (PMIC). The Qorvo® PAC22140 serves as a Smart Battery Monitoring System (BMS) capable of overseeing Li-Ion, Li-Polymer, and LiFePO4 battery packs ranging from 10-series to 20-series.

TechInsights has slightly lowered handset and smartphone sales forecast numbers from 2023 onwards due to the slower than expected China and India recovery, the continued geo-political tensions, and the continued macroeconomic headwinds across the globe.

TechInsights has slightly upwards adjusted global smartphone forecast numbers in 2023 and 2024 to factor the better-than-expected Q3 2023 performance, the normalized inventory status, as well as the improved macroeconomic outlook.

Analog and Power IC sales on track to decrease 5% YoY .

The Chip Insider Graphics

Process flow analysis of the Samsung S5KHP3SP, 1/1.4”, 200 MP, 0.56 μm Pixel Pitch, Back-Illuminated, ISOCELL Tetra2pixel and Super QPD CMOS Image Sensor. The HP3 CIS uses full depth front deep trench isolation (F-DTI) for pixel isolation, Tetra2pixel (4x4 color filter array), and 2x2 OCL for Super Quad Photo Diode (QPD) phase detection autofocus (PDAF).