Deep Dive Teardown of the OnePlus Open CPH2551 Smartphone

Power Management (PM8550VE-001, PM8550VS-001, and PM8550-001) used in Samsung version S24 Ultra, which indicates the use of the same chipset as flagships smartphones. ICs from Skyworks, Qualcomm and Murata provide RF chips for smartphones. Of the new RF chips, the most notable is the LB Front-End Module (SKY58101-11). OnePlus has WiFi 7 and Bluetooth 5.3, for this used Qualcomm IC (WCN7851-101).
20Mar

Intel Core Ultra 7 155H Meteor Lake CPU Die (Intel 4) Advanced CMOS Process Analysis

This report provides an analysis of the structure and materials used in the manufacture of the of the Intel Core Ultra 7 155H (Meteor Lake) CPU die (compute tile), fabricated using the Intel 4 finFET process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
20Mar

Consolidated Datacenter Forecast Q1 2024

The consolidated datacenter forecast aggregates data from multiple TechInsights specialists to produce a single view of the memory, processors, accelerators, and servers required to support the world's data centers over the next five years. The data are further broken down into hyperscaler and public cloud breakdowns.
19Mar

Top 10 Smartphone Models

Explore the top 10 smartphone models unveiled at MWC 2024, ranging from sleek flagships to budget-friendly alternatives. Discover groundbreaking innovations and cutting-edge features that redefine the mobile experience.
19Mar