Latest Blogs and Commentary
Microprocessor Report February 2025 Review
Explore February’s key tech highlights, from AWS’s Trainium2 to Intel’s Arrow Lake, plus 77 product launches and major advancements in AI and quantum computing.
Tracker: VALUE SHARE: Global Fitness Band Revenue and ASP by Vendor by Price Tier: 2024 Q3
Fitness band revenues slowed in Q3 2024 as demand shifts to smarter devices—discover the latest trends and key vendors in our exclusive report!
Insight: SK hynix Withdraws from CIS Business Amid Rising Competition
SK hynix exits the CMOS Image Sensor market as competition intensifies. Discover the factors behind its decline and strategic shift in this exclusive insight.
Tracker: VALUE SHARE: Global Smartwatch Revenue and ASP by OS by Price Tier: 2024 Q3
Global smartwatch revenues remained flat in Q3 2024, with Apple leading watchOS and Wear OS making gains. Explore our report on the competitive battle in the sub-$500 segment!
Tracker: VALUE SHARE: Global Smartwatch Revenue and ASP by Vendor by Price Tier: 2024 Q3
Global smartwatch revenues remained flat in Q3 2024 as new models balanced pricing pressures. Can vendors drive growth in the sub-$500 segment? Explore our report!
Narrative: China Dual Credit 2023 Results
China's PV market hit record CAFC and NEV surpluses in 2023—BYD dominated, Tesla led global OEMs, while VW, GM, and others struggled to keep up. What’s next?
Toshiba TPD4165K HV SOI Motor Driver PMIC Essentials
The Toshiba TPD4165K is a high-voltage IPD for BLDC motors, featuring a compact HDIP30 package, built-in gate drivers, and advanced protection for efficient, reliable performance.
HiSilicon Hi1105-GFCV150 WiFi/BT/GNSS/NearLink Combo SoC RFIC Process Analysis
Discover the HiSilicon Hi1105-GFCV150 die, uncovered inside its component from the Huawei Mate 70 Pro+—a glimpse into Huawei’s latest tech innovation!
Silicon Trends and Carbon Footprints
A look into the year-over-year growth of silicon shipments and semiconductor carbon emissions.
Unknown LEO210 UWB SoC (1000_V5 Die) Floorplan Analysis
Explore our Basic Floorplan Analysis of the 1000_V5 RF transceiver die found in Huawei’s Mate 70 RS Ultimate, detailing its integration within the LEO210 UWB component and dual-die structure.
Smartphone Vendor Market Share for 60 Countries: Q4 2024
Track smartphone market trends with our in-depth report covering 60 countries, where Apple and Samsung lead Q4 2024’s 2.6% YoY shipment growth—insights essential for every mobile industry stakeholder.
Analysis: Leading-Edge Design Completions Soaring in 2025
Discover why leading-edge design completions are set to rise 3% in 2025, as strong investment drives next-gen product innovation despite growing design challenges.
Narrative: 60 Country Markets by Smartphone Vendor: Q4 2024
Get insights into smartphone market performance across 60 countries in Q4 2024, including vendor rankings, shipments, market share, and key trends shaping global and local markets.
McClean Report March 2025: 2024 Semiconductor Ranking and Q1 Outlook
Discover how NVIDIA became the world’s largest semiconductor company in 2024, surpassing $100B in annual revenue and driving major growth in the global semiconductor market.