Latest Blogs and Commentary
Deep Dive Teardown of the Huawei Mate 60 Pro+ ALN-AL10 Smartphone
Internally the Mate 60 Pro+ is almost identical to the Pro variant, both utilizing HiSilicon’s Kirin 9000S processor with memory supplied by SK Hynix. Almost all the internal components, including the main board and other substrates are shared between these two phones. Also similar are the cameras, but while having the same functional set, the sensors used in both devices differ.
Deep Dive Teardown of the Tecno Phantom V Flip AD11 Smartphone
The Tecno Phantom V Flip AD11 is the first flip version of smartphone from Tecno. It was released on September 24, 2023. The mobile runs on HIOS 13.5 (Based on Android 13). This model (AD11) was made for all regions.
Deep Dive Teardown of the Apple iPhone 15 Pro Max A2849 Smartphone
The iPhone 15 Pro Max A2849 is the highest model in the newest generation of Apple’s smartphones. It’s intended for the American market as it’s packed with 5G mmWave antennas and chips.
eBook - The Elusive Solid-State Battery: Is the Yoshino Technologies Power Station Battery Truly Solid-State?
Discover the latest breakthroughs in solid-state battery technology from Yoshino Power Systems and Toyota. Explore the unexpected findings from our analysis of the Yoshino B330SST units, available for download in our comprehensive eBook.
Survey Plus Teardown of the Apple iPhone 15 Pro A3104 Smartphone
What's new in iPhone 15 Pro is the use of USB Type C instead of the Lightning connector used in iPhone 14. The data transfer rate over the wire has increased to 10 Gbit/s. To achieve such data transfer speeds, the user will have to buy a cable that supports USB 3.0.
Deep Dive Teardown of the Sony Xperia 1 V XQ-DQ54 Smartphone
The Sony Xperia 1 V is the successor to the Sony Xperia 1 IV. Released on July 28, 2023, this smartphone was made for the international market and is based on the Android 13 system.
NXP Semiconductors 30V4E0 TSMC 28 nm eFlash Memory Floorplan Analysis
This is a Memory Floorplan Analysis (MFR) of the NXP Semiconductors 30V4E0 eFlash die with TSMC 28 nm HPL technology.
iPhone 15 Pro Max Rear LiDAR Camera Process Flow Analysis
The Sony IMX591 LiDAR SPAD sensor from the Apple iPhone 15 Pro/Pro Max LiDAR Camera has basically the same pixel size but has a smaller pixel array and resolution than its predecessor.
Deep Dive Teardown of the Lenovo Tab Extreme TB570FU Tablet
The Lenovo Tab Extreme, Apple iPad Pro, and Samsung Galaxy Tab S8 Ultra offer distinct features catering to diverse preferences and needs.
Deep Dive Teardown of the Kioxia PM7-R KPM7XRUG3T84 SSD
The SSD is optimized for read-intensive applications. It features 1 DWPD with 100 % Random Write Workload with a Mean Time To Failure (MTTF) of 2.5 million Hours. The SSD has use cases such as data warehousing and Streaming Media Applications.
Deep Dive Teardown of the Huawei Mate 60 BRA-AL00 Smartphone
HiSilicon has the most design wins for the Huawei Mate 60 BRA-AL00, supplying 8 of the 27 major designs.
Deep Dive Teardown of the Amazon Kindle Scribe C4A6T4 E-book Reader
The Amazon Kindle Scribe is a new device that combines the features of an e-reader and a digital notebook.
TSMC Goes Big, Samsung Small at 3 nm
TechInsights looks at the world’s first 3 nm products. Apple’s A17 chip from the iPhone 15 employs TSMC’s FinFET process, and Samsung quietly released their first gate-all-around nanosheet chip in the WhatsMiner cryptocurrency rig.
Aspinity Tackles Analog Variability
Aspinity’s AML100 always-on inference chip uses analog circuits to reduce power. The company has taken a unique approach to taming the effects of process and environmental variation.
AMD’s MI300X Takes On H100
AMD is targeting the data-center AI acceleration market with its MI300X accelerator. The 3D chiplet is based on CDNA3 architecture and offers up to 2 PetaOPS INT8 performance.
TechInsights’ Critical Subsystems – Driving Forces Update
Critical Subsystems showed signs of improvement as 3Q23 data came in which upgraded our full year expectations. This report accompanies the full CSUBs Driving Forces update for December 2023.
OnMicro OM9902-11 Phase 5N Power Amplifier Mod (102F PA die) Cct Report (RFFC)
OnMicro 102F Power Amplifier die from the OnMicro OM9902-11 Phase 5N Power Amplifier Module found on the Honor 60 Pro (TNA-AN00)
Q3 2023: HMD (Nokia): Lowest Smartphone ASP in Past Two Years
In Q3 2023, HMD’s worldwide handset shipment dropped marginally by 1% YoY. Handset ASPs decreased annually for the first time in the past nine quarters, and smartphone ASPs fell to the lowest point in two years in Q3 2023, making it difficult for Nokia to position itself as a premium mid-tier brand.
